Mounter and method for inspecting suction posture of electronic component using mounter

5:

• A head unit comprising:
• a suction nozzle capable of picking up an electronic component, the head unit being configured to transfer the electronic component picked up by the suction nozzle to a specified position on a circuit board;
• a head-side imaging device capable of being attached to the head unit and configured to image a pickup orientation of the electronic component picked up by the suction nozzle;
• a component data acquiring section configured to acquire a size of the electronic component;
• an image processing section configured to process an image captured by the head-side imaging device;
• and an image processing pattern selecting section configured to select an image processing range and image processing accuracy of the image processing section, wherein
• the image processing pattern selecting section, based on the size of the electronic component, is able to select one image processing range from multiple predetermined image processing ranges, is able to select one image processing accuracy from multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, selects a smaller image processing range from the multiple image processing ranges, and selects a more accurate image processing accuracy from the multiple image processing accuracies, and
• the image processing section performs image processing according to the image processing range and image processing accuracy selected by the image processing pattern selecting section.

6:

• An electronic component pickup orientation inspection method for inspecting the pickup orientation of the electronic component picked up by a suction nozzle of a mounter configured to mount the electronic component picked up by the suction nozzle at a specified location on a board, the method comprising:
• an acquiring step of acquiring a size of the electronic component picked up by the suction nozzle;
• an imaging step of imaging the pickup orientation of the electronic component picked up by the suction nozzle;
• a selecting step of selecting, based on the size of the component acquired in the acquiring step, an image processing range and an image processing accuracy of the image captured in the imaging step;
• an image processing step of image processing the image captured in the imaging step using the image processing range and the image processing accuracy selected in the selecting step;
• wherein
• in the selecting step, based on the size of the electronic component, one image processing range is able to be selected from multiple predetermined image processing ranges, one image processing accuracy is able to be selected from multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, a smaller image processing range is selected from the multiple image processing ranges, and a more accurate image processing accuracy is selected from the multiple image processing accuracies.