Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms

A system comprising:

• an electronic device embedded on a substrate;
• and
• a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

A method comprising:

• fabricating an electronic circuit into a substrate;
• and
• fabricating a plurality of embedded wickless capillary driven constrained vapor bubble heat pipes into the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

An apparatus comprising:

• a substrate;
• and
• a plurality of wickless heat dissipation means embedded in the substrate, each wickless heat dissipation means including a body having an in-built channel means therein with generally square corners and a high energy interior surface, and a fluid means partially filling the in-built channel means to dissipate heat between an evaporator region and a condenser region.