Method of manufacturing wiring board and wiring board
AssigneeOlympus Corporation
InventorJumpei YONEYAMA
Life of this patent
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Abstract
A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.
Claims20
A method of manufacturing a wiring board comprising:
- a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via insulating layers provided among the wiring layers and a laminated plate is manufactured;
- and
- a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.
A wiring board including N (N is an integer equal to or greater than 2) flying leads projecting from an end face of a wiring board including a plurality of insulating layers as substrates,
- the plurality of insulating layers being stacked in a direction in which the N flying leads are disposed in a row.
Dependencies are inferred from the claim text.