Image pickup element, imaging device, and imaging method
AssigneeSony Corporation
InventorsNobuo UEKI, Masuyoshi KUROKAWA, Yoichi YAGASAKI, Makoto AOKI
Life of this patent
Estimating the term…
Abstract
In order to improve imaging performance, an imaging apparatus is provided to include an image capturing unit configured to detect incident light and generate a raw image data, a compression unit configured to compress the raw image data to generate a coded data having a data amount smaller than that of the raw image data, and an output unit configured to output the coded data to a processing unit for processing the coded data. Furthermore, the image capturing unit, the compression unit, and the output unit are configured to be within a same semiconductor package.
Claims10
An imaging apparatus comprising:
- an image capturing unit configured to detect incident light and generate raw data;
- a compression unit configured to perform simplified compression for the raw data to generate coded data having a data amount smaller than that of the raw data;
- and
- a memory unit configured to store the coded data,
- wherein the image capturing unit, the compression unit, and the memory unit are configured to be within a same semiconductor package, and
- wherein the image capturing unit is fabricated on a first semiconductor substrate, the compression unit is fabricated on a second semiconductor substrate, and the memory unit is fabricated on a third semiconductor substrate.
A method comprising:
- detecting incident light by an image capturing unit that is fabricated on a first semiconductor substrate;
- generating raw data based on the detected incident light;
- performing, by a compression unit that is fabricated on a second semiconductor substrate, simplified compression for the raw data to generate coded data having a data amount smaller than that of the raw data;
- and
- storing the coded data in a memory unit that is fabricated on a third semiconductor substrate,
- wherein the image capturing unit, the compression unit, and the memory unit are configured to be within a same semiconductor package.
Dependencies are inferred from the claim text.