Thin film coil and electronic device having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDae Ki LIM, Tae Sung KIM, Hyeon Gil NAM, Chan Gwang AN, Hyun Seok LEE, Ki Won CHANG, Chang Mok HAN, Sang Woo BAE, Sung Eun CHO, Jae Suk SUNG
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Abstract
There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
Claims9
A coil substrate provided in a wireless power transmitter, wirelessly transmitting power, or in a wireless power receiver, wirelessly receiving power, the coil substrate comprising:
- a substrate having a first surface and a second surface;
- a first spiral pattern disposed on the first surface of the substrate, and having a partially disconnected spiral shape;
- a second spiral pattern disposed on the second surface of the substrate, and having both ends electrically connected to the first spiral pattern;
- a lead-out pattern having an end connected to the first spiral pattern, and disposed on the first surface of the substrate to traverse a disconnected portion of the first spiral pattern from an inside of the first spiral pattern to an outside of the first spiral pattern;
- wherein the first spiral pattern is electrically connected to the first spiral pattern in the disconnected portion by a plurality of first vias, and the second spiral pattern and the coil substrate is manufactured by disposing the first spiral pattern and the lead-out pattern on the first surface of the substrate, disposing the second spiral pattern on the second surface of the substrate, and providing the plurality of vias to penetrate through the substrate.
Dependencies are inferred from the claim text.