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US 2017/0317466 A1Published application
Devices including dielectric layers(s) and interface layers(s)
AssigneeHewlett Packard Enterprise Development LP
InventorsXue Huang, Di Liang
Life of this patent
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Abstract
An example device in accordance with an aspect of the present disclosure includes at least one dielectric layer sandwiched between first and second layers, to provide a dielectric characteristic for the device. At least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, is to serve as bond enhancement between the at least one dielectric layer and other layers.
Claims15
A device comprising:
- a first layer of a first non-dielectric material;
- a second layer of a second non-dielectric material;
- at least one dielectric layer sandwiched between the first layer and the second layer, to provide a dielectric characteristic for the device;
- at least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, to provide increased surface smoothness and bonding surface energy for the at least one dielectric layer, wherein the at least one interface layer is comprised of a dielectric material;
- and
- wherein the at least one interface layer includes at least one first interface layer between the first layer and the at least one dielectric layer, and at least one second interface layer between the at least one dielectric layer and the second layer.
3 more elements
(canceled)
A device comprising:
- a first layer of a first semiconductor material;
- a second layer of a second semiconductor material;
- at least one dielectric layer sandwiched between the first layer and the second layer, to provide a dielectric characteristic for the device;
- at least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, to provide increased surface smoothness and bonding surface energy for the at least one dielectric layer;
- and
- wherein the at least one interface layer includes at least one first interface layer between the first layer and the at least one dielectric layer, and at least one second interface layer between the at least one dielectric layer and the second layer.
3 more elements
An opto-electronic device comprising:
- a first layer of a first non-dielectric material;
- a second layer of a second non-dielectric material;
- at least one low-k dielectric layer sandwiched between the first layer and the second layer, to provide a dielectric characteristic for the device;
- at least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, to provide increased surface smoothness and bonding surface energy for the at least one dielectric layer, wherein the at least one interface layer is comprised of a low-k dielectric material;
- and
- wherein the at least one interface layer includes at least one first interface layer between the first layer and the at least one dielectric layer, and at least one second interface layer between the at least one dielectric layer and the second layer.
3 more elements
Dependencies are inferred from the claim text.