Substrate for semiconductor light emitting device and semiconductor light emitting device, and manufacturing methods thereof
AssigneeOji Holdings Corporation
InventorsYoshihisa HATTA, Kei SHINOTSUKA, Kotaro DAI, Yasuhito KAJITA
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Abstract
A method of manufacturing a semiconductor light emitting device, the method including arranging multiple particles M in a monolayer on a substrate S, dry etching the multiple particles M arranged to provide a void between the particles M in a condition by which the particles M are etched while the substrate S is not substantially etched; and dry etching the substrate S by using the multiple particles M1 after the particle etching as an etching mask, thereby forming an uneven structure on one surface X the substrate S.
Claims5
A method of manufacturing a semiconductor light emitting device substrate, the method comprising:
- arranging a plurality of particles in a monolayer on an upper surface of a substrate to form a monolayer particle film;
- dry etching said plurality of particles arranged to provide a void between the particles in a condition in which said particles are etched while said substrate is not substantially etched;
- and
- etching said upper surface using said monolayer particle film as a mask, wherein in said substrate etching,
- a step-like structure is formed in a region that is exposed in the upper surface of said substrate after said particle etching.
Dependencies are inferred from the claim text.