High Impact Solder Toughness Alloy

A lead-free solder alloy, comprising:

• from 35 to 59 wt % Bi;
• from greater than 0 to 1.0 wt % Cu;
• from 0.003 to 0.5 wt % Co;
• from 0.01-1.0 wt % Ag;
• optionally
• from 0 to 1.0 wt % Au;
• from 0 to 1.0 wt % Cr;
• from 0 to 2.0 wt % In;
• from 0 to 1.0 wt % P;
• from 0 to 1.0 wt % Sb;
• from 0 to 1.0 wt % Sc;
• from 0 to 1.0 wt % Y;
• from 0 to 1.0 wt % Zn;
• from 0 to 1.0 wt % rare earth elements;
• from greater than 0 to 1.0 wt % Al;
• from 0.01 to 1.0 wt % Ce;
• from 0.001 to 1.0 wt % Ge;
• from greater than 0 to 1.0 wt % Mg;
• from greater than 0 to 1.0 wt % Mn;
• from 0.01 to 1.0 wt % Ni;
• and
• from greater than 0 to 1.0 wt % Ti,
• and the balance Sn, together with any unavoidable impurities.

A lead-free solder alloy, comprising:

• from 35 to 59 wt % Bi;
• from 0.01 to 1.0 wt % Ag;
• from 0.01 to 0.05 wt % Ni;
• and balance Sn, together with any unavoidable impurities.

The alloy of claim 1 consisting essentially of:

• from 35 to 59 wt % Bi;
• from greater than 0 to 1.0 wt % Cu;
• from 0.01 to 0.07 wt % Co;
• from 0.01-0.8 wt % Ag;
• balance Sn;
• and
• unavoidable impurities.

The alloy of claim 1 consisting of:

• from 35 to 59 wt % Bi;
• from greater than 0 to 1.0 wt % Cu;
• from 0.01 to 0.07 wt % Co;
• from 0.01-0.8 wt % Ag;
• balance Sn;
• and
• unavoidable impurities.

The alloy of claim 1 consisting essentially of:

• from 57 to 59 wt % Bi;
• from 0.1 to 0.3 wt % Cu;
• from 0.02 to 0.04 wt % Co;
• from 0.01-0.8 wt % Ag;
• balance Sn;
• and
• unavoidable impurities.

The alloy of claim 1 consisting of:

• from 57 to 59 wt % Bi;
• from 0.1 to 0.3 wt % Cu;
• from 0.02 to 0.04 wt % Co;
• from 0.01-0.8 wt % Ag;
• balance Sn;
• and
• unavoidable impurities.

The alloy of claim 1 consisting of:

• from 35 to 59 wt % Bi;
• from 0.05 to 0.5 wt % Cu;
• from 0.01 to 0.07 wt % Co;
• from 0.01 to 1.0 wt % Ag;
• balance Sn;
• and
• unavoidable impurities.