Automatic assembling system for improving yield of automatic assembly of printed circuit board, and automatic assembling method

An automatic assembling system comprising at least one part mounting cell in charge of a mounting process of soldering an electronic part to a printed circuit board, at least one downstream process cell in charge of a downstream process including a manufacturing process following the mounting process, and at least one manufacturing management device that receives data from the part mounting cell, transmits the data to the downstream process cell, and manages manufacturing,

• wherein the part mounting cell includes a solder mounting unit that solders the electronic part to the printed circuit board, a printed-circuit-board information acquisition unit that acquires printed circuit board information including at least one of position information on an alignment mark disposed at a specific position on the printed circuit board so as to facilitate position arrangement of the printed circuit board, mounting position information on the electronic part on the printed circuit board, and warpage information on the printed circuit board, and a data transmission unit that transmits the acquired printed circuit board information to the manufacturing management device,
• the manufacturing management device includes a data reception unit that receives the printed circuit board information from the part mounting cell, a compensation data generation unit that compensates for, based on the printed circuit board information, a program to be executed in the downstream process cell, and a data transmission unit that transmits the compensation data to the downstream process cell, and
• the downstream process cell includes a data reception unit that receives the compensation data from the manufacturing management device and a downstream process execution unit that executes the downstream process based on the compensation data generated by the compensation data generation unit.