System and method for fluid cooling of electronic devices installed in a sealed enclosure
OwnerDavid Lane Smithinventor
Life of this patent
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Abstract
A system and method to render inoperable electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.
Claims14
A system comprising:
- at least one sealed volume within an enclosure, a containment vessel defining each of said at least one sealed volume;
- a primary dielectric thermally conductive fluid at least partially filling a representative sealed volume of said at least one sealed volume;
- at least one heat-generating electronic device disposed within said representative sealed volume;
- and
- a mechanism for rendering inoperable said at least one heat-generating electronic device.
A method comprising:
- providing at least one sealed volume within an enclosure, a containment vessel defining each of said at least one sealed volume;
- filling at least partially a representative sealed volume of said at least one sealed volume with a primary dielectric thermally conductive fluid;
- disposing at least one heat-generating electronic device within said representative sealed volume;
- and
- providing a mechanism for rendering inoperable said at least one heat-generating electronic device.
Dependencies are inferred from the claim text.