Cooling electronic devices in a data center

Abstract

A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.

Dependencies are inferred from the claim text.