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US 2017/0303434 A1Published application
Immersion cooling arrangements for electronic devices
AssigneeHamilton Sundstrand Corporation
InventorsShin Katsumata, Charles Shepard
Life of this patent
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Abstract
An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.
Claims20
An electronics cooling arrangement, comprising:
- a housing configured to contain a coolant;
- and
- an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, the passageway being configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.
An immersion cooling arrangement, comprising:
- a sealed housing;
- a dielectric coolant disposed within the housing;
- and
- an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet,
- wherein the inlet is submerged within the dielectric coolant,
- wherein the outlet is submerged within the dielectric coolant, and
- wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing.
4 more elements
A method of cooling an electronic device, comprising:
- introducing fluid from an interior of a housing into a passageway defined by the electronic device;
- flowing fluid through the passageway;
- and
- transferring heat from the electronic device to the fluid flowing through the passageway.
1 more element
Dependencies are inferred from the claim text.