US 2017/0303429 A1 · ELECTRONICS COOLING ASSEMBLY WITH MULTI-POSITION, AIRFLOW-BLOCKING MECHANISM

Abstract

Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

Claims20

Dependent claims

An electronics cooling assembly comprising:

an air-cooled heat sink to couple to one or more heat-generating electronic components to be cooled, the air-cooled heat sink to dissipate heat from the one or more heat-generating electronic components to a cooling airflow passing across the air-cooled heat sink;
an auxiliary air-moving device associated with the air-cooled heat sink and providing, when active, an increased flow rate of the cooling airflow across the air-cooled heat sink;
and
an airflow-blocking mechanism, the airflow-blocking mechanism toggling between a passive airflow position and an active airflow position, wherein in the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the air-cooled heat sink without passing through the auxiliary air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

1 more element

A cooled electronics assembly comprising:

at least one heat-generating electronic component;
an electronics cooling assembly, the electronics cooling assembly comprising:
an air-cooled heat sink coupled to the at least one heat-generating electronic component, the air-cooled heat sink dissipating heat from the at least one heat-generating electronic component to a cooling airflow passing across the air-cooled heat sink;
an auxiliary air-moving device associated with the air-cooled heat sink and providing, when active, an increased flow rate of the cooling airflow across the air-cooled heat sink;
and
an airflow-blocking mechanism, the airflow-blocking mechanism toggling between a passive airflow position and an active airflow position, wherein in the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the air-cooled heat sink without passing through the auxiliary air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

3 more elements

Dependencies are inferred from the claim text.

Electronics cooling assembly with multi-position, airflow-blocking mechanism

Life of this patent

Electronics cooling assembly with multi-position, airflow-blocking mechanism

Life of this patent

Abstract

Claims20