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US 2017/0303405 A1Published application
Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device
AssigneeJX Nippon Mining & Metals Corporation
InventorRYO FUKUCHI
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Abstract
To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable. A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.
Claims19
A copper foil, comprising a roughened layer,
- wherein the roughened layer includes a primary particle layer,
- wherein a surface roughness Ra of a surface on a side of the primary particle layer is 0.12 μm or less, and
- wherein an average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.
Dependencies are inferred from the claim text.