Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
AssigneeHsio Technologies, LLC
InventorJames J. Rathburn
Life of this patent
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Abstract
A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.
Claims18
A high density region for a low density circuit comprising:
- at least a first dielectric layer deposited on the first surface of a first circuitry layer imaged to create a plurality of first recesses;
- surfaces of the first recesses plated electro-lessly with a conductive material comprising a first conductive structure electrically coupled to, and extending generally perpendicular to, the first circuitry layer,
- a conductive material electro-plated to the first conductive structure to substantially fill the first recesses;
- at least a second dielectric layer deposited on the first dielectric layer to include a plurality of second recesses imaged to generally align with a plurality of the first conductive structures;
- surfaces of the second recesses plated electro-lessly with a conductive material comprising second conductive structures electrically coupled to, and extending generally perpendicular to, the first conductive structures;
- and
- a conductive material electro-plated to the second conductive structures to substantially fill the second recesses.
A high density region for a low density circuit comprising:
- at least a first dielectric layer comprising a liquid crystal polymer film deposited on the first surface of a first circuitry layer imaged to create a plurality of first recesses;
- surfaces of the first recesses plated electro-lessly with a conductive material comprising a first conductive structure electrically coupled to, and extending generally perpendicular to, the first circuitry layer;
- a conductive material electro-plated to the first conductive structure to substantially fill the first recesses;
- at least a second dielectric layer comprising a liquid crystal polymer deposited on the first dielectric layer to include a plurality of second recesses imaged to generally align with a plurality of the first conductive structures;
- and
- surfaces of the second recesses plated electro-lessly with a conductive material comprising second conductive structures electrically coupled to, and extending generally perpendicular to, the first conductive structures.
Dependencies are inferred from the claim text.