Surface mount device stacking for reduced form factor

A stacked filter assembly for use in a packaged module, the stacked filter assembly comprising:

• a substrate;
• and
• a stacked filter assembly supported by the substrate and configured as a filter circuit, the stacked filter assembly including a plurality of passive components, each passive component of the plurality of passive components packaged as a surface mount device, at least one passive component being in direct communication with the substrate and at least another passive component supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

A wireless communication device comprising:

• an antenna implemented to receive a radio frequency input signal and to transmit a radio frequency output signal;
• and
• a packaged module including a substrate, a first die supported by the substrate and including at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry, a stacked filter assembly supported by the substrate and configured as a filter circuit that is in communication with one of the one or more of the radio frequency transmitter circuitry and the radio frequency receiver circuitry, and an overmold which encloses the first die and the stacked filter assembly, the stacked filter assembly including a plurality of passive components, each passive component of the plurality of passive components packaged as a surface mount device, at least one passive component being in direct communication with the substrate and at least another passive component supported above the substrate by the at least one passive component that is in the direct communication with the substrate.