Manufacturing method of semiconductor package

A manufacturing method of semiconductor package, comprising:

• providing a conductive carrier, wherein the conductive carrier has an upper surface and a lower surface opposite to the upper surface;
• forming a first conductive layer on the lower surface of the conductive carrier, wherein the first conductive layer has a lower surface;
• forming a second conductive layer on the lower surface of the first conductive layer, wherein the second conductive layer and the first conductive layer together constitute a conductive structure;
• disposing an electrical component on the lower surface of the first conductive layer;
• forming a first package body encapsulating the first conductive layer, the second conductive layer and the electrical component but not covering an edge of the lower surface of the conductive carrier;
• removing a portion of the first package body until the second conductive layer is exposed;
• and
• removing partial material of the conductive carrier, such that a reserved part of the conductive carrier forms a ring-shaped conductive structure, wherein the ring-shaped conductive structure maintained on the upper surface of the package body surrounds the conductive structure and the electrical component and exposes the upper surface of the conductive structure.