Printed wiring board
AssigneesFujikura Ltd., DDK Ltd.
InventorsYuki Ishida, Masayuki Suzuki, Harunori Urai, Isao Kojima
Life of this patent
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Abstract
A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.
Claims16
-9. (canceled)
A printed wiring board comprising one or more substrates including a first substrate, the first substrate comprising:
- pads to be connected to a connector as another component, the pads including a first pad and a second pad, the first pad being formed at one main surface of the first substrate and transmitting a first signal, the second pad being disposed in parallel with the first pad, being separated from the first pad by a groove and transmitting a second signal that is a reverse-phase signal of the first signal;
- wirings formed at the one main surface of the first substrate, the wirings including a first wiring and a second wiring, the first wiring being connected to the first pad, the second wiring being disposed in parallel with the first wiring and connected to the second pad, the wirings functioning as differential signal lines;
- and
- a first ground layer to be connected to a ground contact, the first ground layer being formed to have an inner edge so as to surround a region from its entire circumference, the region including the first pad, the first wiring, the second pad and the second wiring, the inner edge of the first ground layer being located at a location separated from an outer edge of the region by a groove.
A printed wiring board comprising one or more substrates including a first substrate, the first substrate comprising:
- pads to be connected to a connector as another component, the pads including a first pad and a second pad, the first pad being formed at one main surface of the first substrate and transmitting a first signal, the second pad being disposed in parallel with the first pad, being separated from the first pad by a groove and transmitting a second signal that is a reverse-phase signal of the first signal;
- and
- a fourth ground layer to be connected to a ground contact, the fourth ground layer being formed to have an inner edge so as to surround a region from its entire circumference, the region including the first pad and the second pad, the inner edge of the fourth ground layer being located at a location separated from an outer edge of the region by a groove.
Dependencies are inferred from the claim text.