Printed wiring board and method for manufacturing the same

A method for manufacturing a printed wiring board, comprising:

• forming a laminated base material comprising a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and at least one of the surface conductor layer and the conductor layer;
• and
• laminating a solder resist layer on a surface of the laminated base material such that the solder resist layer covers the surface conductor layer,
• wherein the forming of the laminated base material comprises forming the internal bonding layer on a surface of the conductor layer having an arithmetic average roughness Ra of less than 100 nm such that the internal bonding layer has an outer surface having an arithmetic average roughness Ra in a range of 100 nm or more and 300 nm or less, and forming the interlayer insulating layer on the conductor layer on which the internal bonding layer is formed, and forming the surface conductor layer on the interlayer insulating layer, and the laminating of the solder resist layer comprises laminating the solder resist layer on a surface of the surface conductor layer having an arithmetic average roughness Ra of less than 100 nm.