Thermal management of printed circuit board components

A printed circuit board (PCB) with enhanced durability, said PCB comprising a plurality of PCB layers, wherein at least one of said PCB layers comprises:

• a base material formed from a three-dimensional (3D) woven fiberglass fabric impregnated with a resin, said 3D woven fiberglass fabric comprising:
• a first group of fibers arranged in a plurality of parallel layers, where each layer comprises a plurality of fibers extending along at least a first (x-axis) direction and aligned in a first (x-y) plane, and where said parallel layers are arranged along a second (z-axis) direction that is orthogonal to said first (x-y) plane;
• and
• a second group of fibers extending along at least said second (z-axis) direction, said second group of fibers being interlaced with said first group of fibers;
• a layer of conductive material deposited onto a surface of said base material;
• and
• at least one conductive plated through hole (PTH) extending through said base material of a plurality of said PCB layers, wherein the coefficient of thermal expansion (CTE) of said base material along said second (z-axis) direction substantially matches the CTE of said conductive material along said first (x-axis) direction.

A method for fabricating a PCB with enhanced durability, the method comprising the procedures of:

• forming a base material for at least one PCB layer from a three-dimensional (3D) woven fiberglass fabric, said 3D woven fiberglass fabric comprising:
• a first group of fibers arranged in a plurality of parallel layers, where each layer comprises a plurality of fibers extending along a first (x-axis) direction and aligned in a first (x-y) plane, and where said parallel layers extend along a second (z-axis) direction that is orthogonal to said first (x-y) plane;
• and
• a second group of fibers extending along at least said second (z-axis) direction, said second group of fibers being interlaced with said first group of fibers;
• impregnated said base material with a resin;
• depositing a layer of conductive material onto a surface of said base material;
• and
• forming at least one conductive plated through hole (PTH) extending through said base material of a plurality of layers of said PCB, wherein the coefficient of thermal expansion (CTE) of said base material along said second (z-axis) direction substantially matches the CTE of said conductive material along said first (x-axis) direction.