Printed Circuit Board Integrated Radio Frequency Absorber
AssigneeL-3 Communications Corporation
InventorGerald COLES
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB), electronic assembly, and method are provided. A PCB adapted to receive a radio frequency (RF) chip includes one or more features that extend through at least a portion of the depth of the PCB. The features are filled with an RF absorber composite comprising a binder and an RF absorber material. The features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.
Claims20
A printed circuit board (PCB) adapted to receive a radio frequency (RF) chip, comprising:
- one or more features extending through at least a portion of the depth of the PCB, wherein the one or more features are filled with an RF absorber composite comprising a binder and an RF absorber material, and wherein the one or more features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.
An electronic assembly, comprising:
- a printed circuit board (PCB);
- and
- a radio frequency (RF) chip, mounted to the PCB in a flip-chip configuration,
- wherein the PCB comprises one or more features extending through at least a portion of the depth of the PCB, wherein the one or more features are filled with an RF absorber composite comprising a binder and an RF absorber material, and wherein the one or more features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.
A method for fabricating a printed circuit board (PCB) for use with a radio frequency (RF) chip, the method comprising:
- forming one or more cavities in at least one substrate of a PCB;
- and
- filling the one or more cavities with an RF absorber composite comprising a binder and an RF absorber material,
- wherein the one or more cavities are positioned in the PCB substrate to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.
Dependencies are inferred from the claim text.