Microphone package with molded spacer
AssigneeRobert Bosch GmbH
InventorsJay Scott Salmon, Kuldeep Saxena
Life of this patent
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Abstract
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.
Claims19
A microelectromechanical system (MEMS) microphone package comprising:
- a substrate including electrical connection pads;
- a conductive lid including an acoustic input port;
- a MEMS microphone die attached to the conductive lid and configured to generate an electrical signal based on acoustic pressure;
- and
- a package spacer having a top surface and a bottom surface, the top surface connected to the conductive lid and the bottom surface secured to the substrate, the package spacer formed of a molded material.
Dependencies are inferred from the claim text.