3d imaging system and mobile phone having same

A mobile phone comprising:

• a back cover on which a first window and a second window are defined;
• a light source;
• a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal;
• a first light splitting device connected with the light source and configured to split light from the light source into a light output in a first optical path and a light output in a second optical path, the light output in the first optical path being directed to an object, passing through or being reflected by the object;
• a second light splitting device connected with the first light splitting device and configured to split the light output in the second optical path into a plurality of optical signals;
• an optical sub-module configured to collect light passing through or reflected by the object and couple the light to a light combining device, the light combining device being connected with the optical sub-module and the second light splitting device, comprising a plurality of light combiners, and configured to combine optical signals coupled from the optical sub-module and optical signals output by the second light splitting device and output a plurality of combined optical signals;
• a light sensing device connected with the light combining device and configured to sense optical output of the light combining device and convert the optical output into a plurality of electrical signals;
• and
• a signal processing module connected with the light sensing device and configured to extract 3D information of the object from the electrical signals;
• wherein:
• the first window is surrounding and aligned with the optical sub-module;
• and
• the second window is surrounding and aligned with the light output in the first optical path of the first light splitting device.

A 3D imaging system comprising:

• a light source being modulated by a frequency sweep signal;
• a first light splitting device connected with the light source and configured to split light from the light source into a light output in a first optical path and a light output in a second optical path, the light output in the first optical path being directed to an object, passing through or being reflected by the object;
• a second light splitting device connected with the first light splitting device and configured to split the light output in the second optical path into a plurality of optical signals;
• an optical sub-module configured to collect light passing through or reflected by the object and couple the light to a light combining device, the light combining device being connected with the optical sub-module and the second light splitting device, comprising a plurality of light combiners, and configured to combine optical signals coupled from the optical sub-module and optical signals output by the second light splitting device and output a plurality of combined optical signals;
• a light sensing device connected with the light combining device and configured to sense optical output of the light combining device and convert the optical output into a plurality of electrical signals;
• and
• a signal processing module connected with the light sensing device and configured to extract 3D information of the object from the electrical signals;
• wherein:
• the optical sub-module comprises a matrix of pixels with m columns and n rows, each pixel comprising a silicon substrate layer, a silicon oxide layer disposed on the silicon substrate layer, a glass layer disposed on the silicon oxide layer, a silicon waveguide layer disposed on the glass layer, and a polysilicon layer partially covering the silicon waveguide layer, a plurality of teeth being formed in the silicon waveguide layer, a photodiode being disposed on the silicon oxide layer and covered by the glass layer;
• the second light splitting device is a light splitter configured to split the light output in the second optical path into k optical signals, k=m×n;
• and
• the light combining device comprises k light combiners, each light combiner being an optical Y-junction configured to combine an optical signal coupled from the optical sub-module and an optical signal output by the second light splitting device and output a combined optical signal.