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US 2017/0302043 A1Published application
Method and System for Coupling a Conductive Substrate to a Ribbon Cable
AssigneeIgor Offenbakh
InventorsIgor Ofenbakh, Norman Freidrich
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Abstract
Devices and methods are disclosed for coupling a multi-conductor cable to a flexible substrate by means of a crimp.
Claims18
A method of coupling a conductive substrate to a cable, the method comprising the steps of;
- a. providing a multi-conductor, insulated electrical cable, b. providing an electrically conductive substrate including for instance an electrically conductive fabric;
- c. providing a wire crimp composed of electrically conductive material wherein a first portion of the crimp is sized and shaped to puncture the insulation of and tap into at least one of the conductors of the cable, a second portion of the crimp is sized and shaped to mechanically couple the crimp to the substrate, and a third portion of the crimp is sized and shaped to mechanically couple the crimp to the cable;
- d. positioning the crimp above a specific conductor of the cable;
- e. positioning the substrate one of between the cable and the crimp, above the crimp and cable, or below the crimp and the cable;
- f driving the crimp into the cable, thereby puncturing the substrate and creating an electrical and mechanical connection between the conductor, the substrate, and the crimp.
2 more elements
A system for mechanically and electrically coupling a planar conductive substrate to a multi-conductor insulated cable using a wire crimp, the system comprising;
- a substantially planar backplate, a driver which travels along an axis normal to the backplate wherein the driver is sized and shaped to urge a wire crimp through the substrate and cable, a carrier for positioning the wire crimp over a specific conductor of the cable before it is driven therethrough;
- wherein the wire crimp has (a) a first protrusion which pierces the insulation surrounding a single conductor of the cable to provide electrical coupling between the conductor and the substrate as the crimp is acted upon by the driver, and (b) a second protrusion which is deformed against the backplate to become engaged about the cable thereby providing mechanical coupling between substrate and the cable.
Dependencies are inferred from the claim text.