Solution precursor plasma spray of ceramic coating for semiconductor chamber applications

A method comprising:

• providing an article;
• feeding a solution into a plasma sprayer, wherein the solution comprises a metal precursor;
• and
• generating, with the plasma sprayer, a stream directed toward the article, wherein the stream forms a ceramic coating on the article upon contact with the article, and wherein the ceramic coating comprises:
• 50-75 mol % of Y2O3, 10-30 mol % of ZrO2, and 10-30 mol % of Al2O3;
• 40-100 mol % of Y2O3, 0-60 mol % of ZrO2, and 0-10 mol % of Al2O3;
• 60-75 mol % of Y2O3, 20-30 mol % of ZrO2, and 0-5 mol % of Al2O3;
• 60-70 mol % of Y2O3, 30-40 mol % of ZrO2, and 0-10 mol % of Al2O3;
• 50-60 mol % of Y2O3 and 40-50 mol % of ZrO2;
• 40-60 mol % of Y2O3, 30-50 mol % of ZrO2, and 10-20 mol % of Al2O3;
• 40-50 mol % of Y2O3, 20-40 mol % of ZrO2, and 20-40 mol % of Al2O3;
• 70-90 mol % of Y2O3, 0-20 mol % of ZrO2, and 10-20 mol % of Al2O3;
• 60-80 mol % of Y2O3, 0-10 mol % of ZrO2, and 20-40 mol % of Al2O3;
• 40-60 mol % of Y2O3, 0-20 mol % of ZrO2, and 30-40 mol % of Al2O3;
• 30-60 mol % of Y2O3, 0-20 mol % of ZrO2, and 30-60 mol % of Al2O3;
• 20-40 mol % of Y2O3, 20-80 mol % of ZrO2, and 0-60 mol % of Al2O3;
• or
• 1-99 mol % Y2O3 and 1-99 mol % YF3.