Laser processing of sapphire substrate and related applications
AssigneeCorning Incorporated
InventorsSasha Marjanovic, Garrett Andrew Piech, Sergio Tsuda, Robert Stephen Wagner
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Abstract
A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
Claims21
A method of laser cutting a material comprising:
- focusing a pulsed laser beam into a laser beam focal line, the laser beam focal line having a length in a range between about 0.1 mm and 100 mm;
- directing the laser beam focal line into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;
- translating the material or the laser beam relative to one another, thereby forming a plurality of defect lines in the material with the laser;
- and
- directing an IR laser beam over the plurality of defect lines.
A method of laser cutting a material comprising:
- (i) focusing a pulsed laser beam into a laser beam focal line, the laser beam focal line having a length in a range between about 0.1 mm and 100 mm;
- ii) directing the laser beam focal line into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;
- (iii) repeatedly performing (i) and (ii) to form a fault line within the material, the fault line including a plurality of the defect lines;
- and
- (iv) directing an IR laser beam over the fault line.
Dependencies are inferred from the claim text.