Method for bonding, manufacturing method of ink layer formed body, and ink layer formed body
AssigneeMimaki Engineering Co., Ltd.
InventorNobutaka Matsunaga
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AssigneeMimaki Engineering Co., Ltd.
InventorNobutaka Matsunaga
Estimating the term…
Provided is a method for favorable bonding between an adherend and an adhesive body, which is capable of suppressing an ink layer, which is formed by an ultraviolet-curable ink, from being smudged while increasing convenience of a bonding operation between the adherend and the adhesive body, and the like. The method for bonding a medium to a foil body includes an ink layer formation process of spotting an ultraviolet-curable ink, which is ejected from an inkjet head, to a medium and irradiating ultraviolet ray to the ultraviolet-curable ink to cure the same, thereby forming an ink layer; a lamination process of laminating the medium and a foil body with the ink layer being sandwiched therebetween; and a bonding process of heating the ink layer, enabling the ink layer to function as an adhesive, and bonding the medium to the foil body.
A method for bonding an adherend to an adhesive body, the method comprising:
A method for bonding an adherend to an adhesive body, the method comprising:
A manufacturing method of an ink layer formed body, the method comprising ejecting an ultraviolet-curable ink, which is capable of functioning as an adhesive upon being heated or when a solvent is applied, from an inkjet head, spotting the ultraviolet-curable ink to a base body, and irradiating ultraviolet ray to the ultraviolet-curable ink to cure the ultraviolet-curable ink, thereby forming an ink layer on the base body.
Dependencies are inferred from the claim text.