Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
AssigneeJX Nippon Mining & Metals Corporation
InventorsHajime MOMOI, Satoru MORIOKA, Toshiyuki ONO, Hideta ARAI, Ryo FUKUCHI, Atsushi MIKI
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Abstract
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
Claims24
A copper material comprising an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, wherein surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
Dependencies are inferred from the claim text.