Thermal conducting sheet and method for producing same
AssigneeKitagawa Industries Co., Ltd.
InventorRika OYA
Life of this patent
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Abstract
A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.
Claims12
A thermal conducting sheet comprising a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer, the reinforcing layer having a hardness greater than a hardness of the low-hardness layer;
- wherein the low-hardness layer comprises:
- from 18 to 25 mass % of acrylic polymer,
- from 30 to 35 mass % of silicon carbide having an average particle size of from 60 μm to 100 μm,
- from 15 to 23 mass % of aluminum hydroxide having an average particle size of from 10 μm to 50 μm,
- from 18 to 30 mass % of magnesium hydroxide having an average particle size of from 1μm to 2μm, and
- from 1 to 5 mass % of plasticizer;
- and
- the reinforcing layer comprises:
- from 20 to 30 mass % of acrylic polymer and from 60 to 80 mass % of aluminum hydroxide having an average particle size of from 10 μm to 50 μm;
- and
- the thermal conducting sheet comprises a bonding interfacial part, the bonding interfacial part comprising an interfacial portion;
- wherein the low-hardness layer and the reinforcing layer are mutually bonded in the interfacial portion, and each of the low-hardness layer and the reinforcing layer penetrates into the bonding interfacial part.
Dependencies are inferred from the claim text.