Method and apparatus for applying a layer having a relief on a flat face of a substrate

An apparatus for applying a layer having a relief on a flat surface of a substrate, the apparatus comprising:

• a frame;
• fixation means connected to the frame and adapted to fixate the substrate with the surface of the substrate onto which the relief is to be applied on top;
• a mould carrying a counter relief;
• and
• a radiation source adapted to emit radiation curing the liquid applied in a layer on the substrate;
• wherein the mould is flexible and that the flexible mould has a profile of a catenary before being brought in contact with the upper surface of the liquid layer and that the apparatus comprises a manipulator connected to the frame, the manipulator being adapted to initially bring the bent mould into contact with the upper surface of the liquid layer and to subsequently bring the mould into contact over an adjacent upper surface area of the liquid layer until the complete liquid layer is in contact with the mould wherein the mould is kept bent until the complete liquid layer is in contact with the mould and at least the part of the mould in contact with the liquid layer is flat, wherein the manipulator is adapted to guide the mould such that the profile of the mould not being in contact with the surface is kept as the same catenary over the whole process of bringing the mould into contact with the surface.