Diamond Composite CMP Pad Conditioner

A method of reconditioning a chemical mechanical planarization pad comprising the steps of:

• providing a chemical mechanical planarization pad mounted to a rigid substrate having an axis normal to the substrate, said pad having a polishing side, and a side opposite said polishing side, said opposite side contacting said rigid substrate;
• providing a pad conditioning body having a contact surface and an axis normal to said contact surface, said contact surface including a composite material having a diamond particulate embedded in a matrix including silicon carbide, wherein at least a portion of said diamond particulate at said contacting surface protrudes from said matrix;
• bringing said contact surface into contact with said polishing side of said pad such that said rigid substrate axis and said conditioning body axis are parallel, and
• moving said contact surface over said polishing side in such a way as to traverse a range of distances between said axes.

A machine for conditioning a chemical-mechanical planarization pad, comprising:

• an arm having a first end and a second end;
• a body having a contact surface configured to condition the polishing surface of a chemical-mechanical planarization pad, said body attached to said first end of said arm;
• said second end of said arm attached to a means for moving said contact surface of said body across the polishing surface of the chemical-mechanical planarization pad;
• wherein said contact surface includes a composite material having a diamond particulate embedded in a matrix including silicon carbide, wherein at least a portion of said diamond particulate at said contacting surface protrudes from said matrix.