Grinding ring set for semiconductor wafer in chemical and mechanical grinding process
OwnerChien-Chung Suninventor
Life of this patent
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Abstract
A grinding ring set for semiconductor wafer in chemical and mechanical grinding process includes a grinding surface and an attaching surface attaching to the grinding surface. Material of the attaching ring is selected from HDPE, PE, PPS, PBT, PEI, PEEK, PET, PTFE, PBI, PAI, PETP, PVC, NYLON, POM, ABS, PVDF, etc. or the combination thereof, compound of two or more plastic additives, which has a weight percentage between 0.9-1.8 g/cm3. The grinding ring set may also be made of plastic materials, but is different from those used in the attaching ring. Therefore, by above mentioned design, the whole weight is light with a preferred strength, lower cost, less processes, and reduction of rust, etc. Furthermore, plastic is more flexible then metal.
Claims4
A grinding ring set for semiconductor wafer in chemical and mechanical grinding process;
- the grinding ring set comprising:
- a grinding surface;
- an attaching surface attaching to the grinding surface;
- and
- wherein material of the attaching ring is selected from High-density polyethylene (HDPE), Polyethylene (PE), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), carbin-filled PEEK, polyetherimide (PEI), polyether ether ketone (PEEK), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polybenzimidazole (PBI), polyamide-imide (PAI), PETP, PVC, NYLON, POM, ABS, PTFE, PVDF, or the combination thereof, or compound of two or more plastic additives, which has a weight percentage between 0.9-1.8 g/cm3.
Dependencies are inferred from the claim text.