Method of connecting a wire to a feedthrough
AssigneeHeraeus Deutschland GmbH & Co. KG
InventorsRobert DITTMER, Senthil Kumar BALASUBRAMANIAN, Leoni WILHELM, Thomas SCHMITT, Thorsten KAISER, Tim ASMUS
Life of this patent
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Abstract
One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
Claims20
A method of connecting a wire to a feedthrough, the method comprising:
- providing a feedthrough comprising an insulator and an electrically conductive cermet pathway, wherein the cermet pathway comprises an electrically conductive metallic material;
- providing a wire comprising an electrically conductive material;
- arranging an end of the wire in at least partial contact with the cermet pathway;
- and
- generating a joint microstructure comprising the material of the cermet pathway and the material of the wire.
A feedthrough system comprising:
- a feedthrough, a wire, and an electrode outside the feedthrough;
- wherein the feedthrough comprises an insulator and an electrically conductive cermet pathway;
- wherein the cermet pathway comprises an electrically conductive metallic material;
- wherein the wire is arranged between the electrode and the cermet pathway;
- and
- wherein the wire is at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
An implantable medical device comprising:
- a feedthrough, a wire, and an electrode outside the feedthrough;
- wherein the feedthrough comprises an insulator and an electrically conductive cermet pathway;
- wherein the cermet pathway comprises an electrically conductive metallic material;
- wherein the wire is arranged between the electrode and the cermet pathway;
- and
- wherein the wire is at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway;
- and
- an electronic device arranged at least partially in electrical contact with the feedthrough.
Dependencies are inferred from the claim text.