# US 2017/0290212 A1 · Flexible light emitting semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0290212 A1 - Document ID: US20170290212A1 - Status: Published application - Kind: A1 - Application number: 15/626,373 - Filed: 2017-06-19 - Published: 2017-10-05 - Earliest claimed: 2011-02-18 - Assignees: 3M Innovative Properties Company - Applicants: 3M Innovative Properties Company - Inventors: Ravi Palaniswamy; Arokiaraj Jesudoss; Alejandro Aldrin II Agacaoili Narag; Siang Sin Foo; Fong Liang Tan; Wei Meng Pee; Andrew J. Ouderkirk; Justine A. Mooney - Web page: https://patentgrep.com/patent/US20170290212A1 ## CPC - H10W 70/688: {Flexible insulating substrates} - H05K 1/112: {directly combined with via connections} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/662: {Semiconductor materials} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/10106: Light emitting diode [LED] - H10H 20/8506: {Containers} - H10H 20/8581: {characterised by their material} - H10H 20/8585: {being an interconnection} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer. ## Claims ### Claim 1 An article comprising: a flexible polymeric dielectric layer having first and second major surfaces, the first major surface having a conductive layer directly thereon, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, the conductive layer including electrically separated first and second portions, each of the first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer. ### Claim 2 (depends on 1) The article of claim 1, further comprising a thermal interface material disposed in the at least one cavity. ### Claim 3 (depends on 1) The article of claim 1, wherein each cavity in the at least one cavity is filled with conductive material. ### Claim 4 (depends on 1) The article of claim 1 further comprising a light emitting semiconductor device supported and electrically connected to the conductive layer on the first major surface by the first and second portions. ### Claim 5 (depends on 1) The article of claim 1, wherein the first and second portions of the conductive layer on the first major surface are electrically separated by a gap, and a thermal interface material is disposed in the gap. ### Claim 6 (depends on 1) The article of claim 1, wherein the first portion is substantially aligned with a first cavity in the at least one cavity and the second portion is aligned with a different second cavity in the at least one cavity. ### Claim 7 (depends on 1) The article of claim 1, wherein the dielectric layer further comprises at least one via extending from the second major surface to the first major surface ### Claim 8 (depends on 7) The article of claim 7, wherein the first portion is substantially aligned with a first cavity in the at least one cavity and the second portion is aligned with a first via in the at least one via. ### Claim 9 (depends on 1) The article of claim 1, wherein a first plane comprises the first major surface and at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. ### Claim 10 A flexible article comprising: a polymeric dielectric layer having a first major surface with a first electrically conductive layer directly thereon and having a second major surface, a first plane comprising the first major surface, a second plane comprising the second major surface, the dielectric layer disposed within a region between the first and second planes, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, the first electrically conductive layer comprising an electrically conductive feature substantially aligned with the at least one cavity, and a light emitting semiconductor device supported by the electrically conductive feature, the light emitting semiconductor device disposed outside the region between the first and second planes. ### Claim 11 (depends on 10) The article of claim 10, wherein the conductive feature comprises electrically separated first and second portions supporting and electrically connecting the light emitting semiconductor device to the conductive layer on the first major surface. ### Claim 12 (depends on 10) The article of claim 10 further comprising a second electrically conductive layer on the second major surface of the dielectric layer. ### Claim 13 (depends on 10) The article of claim 10, wherein the at least one cavity contains thermally conductive material. ### Claim 14 (depends on 10) The article of claim 10, wherein each cavity in the at least one cavity is filled with conductive material. ### Claim 15 (depends on 10) The article of claim 10 further comprising a thermal interface layer abutting the second major surface and the thermally conductive material in the at least one cavity. ### Claim 16 (depends on 10) The article of claim 10, wherein at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. ### Claim 17 An article comprising: a flexible dielectric layer having a first major surface with a first conductive layer directly thereon and having a second major surface, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, each cavity in the at least one cavity filled with conductive material, the first conductive layer comprising a conductive feature substantially aligned with the at least one cavity, and the first conductive layer further comprising conductive pads disposed adjacent the conductive feature. ### Claim 18 (depends on 17) The article of claim 17, wherein the at least one cavity comprises two cavities, the first conductive layer comprising a conductive pad substantially aligned with each cavity. ### Claim 19 (depends on 17) The article of claim 17, wherein a first plane comprises the first major surface and at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. ### Claim 20 (depends on 17) The article of claim 17 further comprising a light emitting semiconductor device supported by the conductive feature.