# US 2017/0290207 A1 · Component Shielding Structures With Magnetic Shielding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0290207 A1 - Document ID: US20170290207A1 - Status: Published application - Kind: A1 - Application number: 15/250,066 - Filed: 2016-08-29 - Published: 2017-10-05 - Earliest claimed: 2016-03-31 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: James B. Smith; Daniel W. Jarvis; David A. Pakula; Gregory N. Stephens; Nicholas G. L. Merz; Shayan Malek; Sina Bigdeli - Web page: https://patentgrep.com/patent/US20170290207A1 ## CPC - H05K 9/0031: {combining different shielding materials} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures. ## Claims ### Claim 1 Apparatus, comprising: a substrate; at least one electrical component mounted on the substrate; and a shielding can attached to the substrate that covers and shields the electrical component, wherein the shielding can includes a plurality of layers of material including a layer of magnetic shielding material. ### Claim 2 (depends on 1) The apparatus defined in claim 1 wherein the layer of magnetic shielding material has a relative permeability of at least 500. ### Claim 3 (depends on 1) The apparatus defined in claim 1 wherein the layer of magnetic shielding material has a relative permeability of at least 1000. ### Claim 4 (depends on 1) The apparatus defined in claim 1 wherein the plurality of layers includes a radio-frequency electromagnetic interference shielding layer. ### Claim 5 (depends on 4) The apparatus defined in claim 4 wherein the radio-frequency electromagnetic interference shielding layer is a metal layer. ### Claim 6 (depends on 5) The apparatus defined in claim 5 wherein the metal layer has a resistivity of less than 3×10−8 ohm-m. ### Claim 7 (depends on 6) The apparatus defined in claim 6 wherein the layer of magnetic shielding material is a printed layer of magnetic material on the metal layer. ### Claim 8 (depends on 6) The apparatus defined in claim 6 wherein the metal layer is a cold-rolled cladding layer on the layer of magnetic shielding material. ### Claim 9 (depends on 8) The apparatus defined in claim 8 wherein the layer of magnetic shielding material comprises a layer of stainless steel. ### Claim 10 (depends on 9) The apparatus defined in claim 9 wherein the stainless steel comprises a stainless steel selected form the group consisting of: 430 stainless steel and 444 stainless steel. ### Claim 11 (depends on 6) The apparatus defined in claim 6 wherein the layer of magnetic shielding material and the metal layer are stamped together and form walls for the shielding can. ### Claim 12 (depends on 1) The apparatus defined in claim 1 wherein the plurality of layers of material include first and second cladding layers on opposing sides of the layer of magnetic shielding material. ### Claim 13 (depends on 12) The apparatus defined in claim 12 wherein the layer of magnetic shielding material comprises stainless steel. ### Claim 14 (depends on 12) The apparatus defined in claim 12 wherein the first and second cladding layers comprise a material selected from the group consisting of: nickel, gold, silver, and copper-nickel. ### Claim 15 (depends on 12) The apparatus defined in claim 12 wherein the first and second cladding layers are larger than the layer of magnetic shielding material so that edge portions of the first and second cladding layers are joined together without any intervening portions of the magnetic shielding material. ### Claim 16 A metal shielding can, comprising: a top wall; and at least one sidewall coupled to the top wall, wherein the top wall and sidewall are formed from coated stainless steel. ### Claim 17 (depends on 16) The metal shielding can defined in claim 16 wherein the coated stainless steel comprises a coating selected from the group consisting of: nickel, copper-nickel, gold, and silver. ### Claim 18 (depends on 17) The metal shielding can defined in claim 17 wherein the coated stainless steel comprises a stainless steel selected from the group consisting of: 430 stainless steel and 444 stainless steel. ### Claim 19 (depends on 16) The metal shielding can defined in claim 16 further comprising a printed layer of magnetic material on the top wall. ### Claim 20 Shielded circuitry, comprising: a support structure; electrical components soldered to the support structure; and a shielding structure that shields the electrical components and that is soldered to the support structure, wherein the shielding structure comprises a stainless steel layer. ### Claim 21 (depends on 20) The shielded circuitry defined in claim 20 wherein the stainless steel layer has a relative permeability of at least 500. ### Claim 22 (depends on 20) The shielded circuitry defined in claim 20 wherein the stainless steel comprises a stainless steel selected from the group consisting of: 430 stainless steel and 444 stainless steel. ### Claim 23 (depends on 22) The shielded circuitry defined in claim 22 wherein the shielding structure comprises a shielding can and wherein the shielding can includes cladding layers on opposing sides of the stainless steel layer. ### Claim 24 (depends on 23) The shielded circuitry defined in claim 23 wherein the cladding layers comprise a metal with more solderability than the stainless steel layer. ### Claim 25 (depends on 20) The shielded circuitry defined in claim 20 wherein the shielding structure comprises a cowling that holds the electrical components to the support structure.