# US 2017/0290205 A1 · Immersion cooling systems and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0290205 A1 - Document ID: US20170290205A1 - Status: Published application - Kind: A1 - Application number: 15/090,049 - Filed: 2016-04-04 - Published: 2017-10-05 - Earliest claimed: 2016-04-04 - Assignees: Hamilton Sundstrand Corporation - Applicants: Hamilton Sundstrand Corporation - Inventors: Charles Shepard; Kris H. Campbell - Web page: https://patentgrep.com/patent/US20170290205A1 ## CPC - H05K 7/20936: {Liquid coolant with phase change} - H05K 7/203: {by immersion} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described. ## Claims ### Claim 1 An electronics cooling arrangement, comprising: a housing; an electronic device disposed within the housing; and a solid-liquid phase change material (PCM) disposed within the housing and in thermal communication with the electronic device, wherein the solid-liquid PCM is configured to absorb heat generated by the electronic device. ### Claim 2 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the solid-liquid PCM is fully submerged within a liquid-vapor phase coolant disposed within the housing. ### Claim 3 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the solid-liquid PCM is partially submerged within a liquid-vapor phase coolant disposed within the housing. ### Claim 4 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the solid-liquid PCM includes wax body. ### Claim 5 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein solid-liquid PCM is in direct contact with a liquid-vapor phase coolant disposed within the housing. ### Claim 6 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the solid-liquid PCM is in indirect contact with a liquid-vapor phase coolant disposed within the housing. ### Claim 7 (depends on 1) An electronics cooling arrangement as recited in claim 1, further including a PCM envelope containing the solid-liquid PCM and submerged within a liquid-vapor phase coolant disposed within the housing. ### Claim 8 (depends on 7) An electronics cooling arrangement as recited in claim 7, wherein the PCM envelope is fixed relative to the housing. ### Claim 9 (depends on 7) An electronics cooling arrangement as recited in claim 7, wherein the PCM envelope is free-floating within a liquid-vapor phase coolant disposed within the housing. ### Claim 10 (depends on 7) An electronics cooling arrangement as recited in claim 7, wherein PCM envelope is a first PCM envelope containing a portion of the solid-liquid PCM, and further including a second PCM envelope containing a second portion of the solid-liquid PCM. ### Claim 11 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the housing and a liquid-vapor phase coolant disposed within the housing define therebetween an ullage space, a condenser being disposed within the ullage space, and a portion of the solid-liquid PCM being disposed within the ullage space. ### Claim 12 (depends on 11) An electronics cooling arrangement as recited in claim 11, further including a heat exchanger disposed on a side of the ullage space opposite the condenser. ### Claim 13 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the electronic device comprises at least one of a capacitor, an inductor, a printed circuit board, a solid-state switch device, heat sink and a solid-state power converter. ### Claim 14 (depends on 1) An electronics cooling arrangement as recited in claim 1, wherein the housing is a sealed housing having a fixed volume. ### Claim 15 (depends on 1) An electronics cooling arrangement as recited in claim 1, further comprising a liquid-vapor phase dielectric coolant contained within the housing. ### Claim 16 (depends on 15) An electronics cooling arrangement as recited in claim 15, wherein the solid-liquid PCM is in thermal communication with the electronic device through the liquid-vapor phase dielectric coolant to absorb heat generated by the electronic device. ### Claim 17 An electronics cooling arrangement for a vehicular electrical system, comprising: a sealed housing; a liquid-vapor phase dielectric coolant contained within the housing; an electronic device submerged within the dielectric coolant, the electronic device having a conductor in direct contact with the dielectric coolant; and a solid-liquid phase change material (PCM) contained within the housing, wherein the solid-liquid PCM is free-floating within the dielectric coolant, and wherein the solid-liquid phase coolant is in thermal communication with the electronic device through the liquid-vapor phase coolant. ### Claim 18 A method of cooling an electronic device, comprising: transferring heat from the electronic device to a fluid; and transferring heat from the fluid to a solid-liquid phase change material (PCM). ### Claim 19 (depends on 18) A method of cooling an electronic device as recited in claim 18, further comprising maintaining the fluid at a constant temperature while the solid-liquid PCM changes phase from a solid to a liquid. ### Claim 20 (depends on 18) A method of cooling an electronic device as recited in claim 18, wherein transferring heat from the electronic device to the fluid includes heating a liquid-vapor phase dielectric coolant contained within a sealed housing using the electronic device while submerged within the coolant, and wherein transferring heat from the fluid to the solid-liquid PCM includes transferring heat between the liquid-vapor phase coolant into the solid-liquid PCM while submerged within the liquid-vapor phase dielectric coolant.