# US 2017/0290149 A1 · Resin sheet

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- Number: US 2017/0290149 A1
- Document ID: US20170290149A1
- Status: Published application
- Kind: A1
- Application number: 15/472,684
- Filed: 2017-03-29
- Published: 2017-10-05
- Earliest claimed: 2016-03-29
- Assignees: Ajinomoto Co., Inc.
- Applicants: Ajinomoto Co., Inc.
- Inventors: Shigeo NAKAMURA; Shiro TATSUMI; Ikumi SAWA
- Web page: https://patentgrep.com/patent/US20170290149A1

## CPC

- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- B32B 7/04: Interconnection of layers
- B32B 15/08: of synthetic resin
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/00: Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)}
- B32B 27/08: of synthetic resin
- B32B 27/10: of paper or cardboard
- B32B 27/18: characterised by the use of special additives
- B32B 27/205: {the fillers creating voids or cavities, e.g. by stretching}
- B32B 27/26: using curing agents
- B32B 27/28: comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42}
- B32B 27/281: {comprising polyimides}
- B32B 27/285: {comprising polyethers}
- B32B 27/288: {comprising polyketones}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/325: {comprising polycycloolefins}
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- C08G 59/621: {Phenols}
- C08G 59/686: {containing nitrogen}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/095: {of vias therein}
- H10W 70/69: Insulating materials thereof
- H10W 70/695: Organic materials
- B32B 2264/02: Synthetic macromolecular particles
- B32B 2264/0207: Particles made of materials belonging to B32B25/00
- B32B 2264/0264: Polyamide particles
- B32B 2307/202: Conductive
- B32B 2307/206: Insulating
- B32B 2307/306: Resistant to heat
- B32B 2307/7265: Non-permeable
- B32B 2307/732: Dimensional properties
- B32B 2457/08: PCBs, i.e. printed circuit boards
- H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)}
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0212: Resin particles
- H05K 2203/06: Lamination
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

## Claims

### Claim 1

A resin sheet, comprising:
a support; and
a resin composition layer being in contact on the support,
wherein
an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less.

### Claim 2 (depends on 1)

The resin sheet according to claim 1, wherein a glass transition temperature of a cured product of the resin composition layer is 160° C. or more.

### Claim 3

A resin sheet, comprising:
a support; and
a resin composition layer being in contact on the support,
wherein
a ratio (B/A) of a tensile breaking strength B of a 10 μm thickness cured product of the resin composition layer after a HAST test to a tensile breaking strength A of a 10 μm thickness cured product of the resin composition layer is 0.65 or more and 1 or less.

### Claim 4 (depends on 3)

The resin sheet according to claim 3, wherein the tensile breaking strength B is 50 MPa or more.

### Claim 5 (depends on 1)

The resin sheet according to claim 1, wherein said resin composition layer has a thickness of 15 μm or less.

### Claim 6 (depends on 1)

The resin sheet according to claim 1, wherein said resin composition layer has a lowest melt viscosity of 1000 poise or more.

### Claim 7 (depends on 1)

The resin sheet according to claim 1, wherein said resin composition layer comprises an epoxy resin and a curing agent.

### Claim 8 (depends on 1)

The resin sheet according to claim 1, wherein
said resin composition layer comprises an inorganic filler in an amount of 50% by mass or more when a nonvolatile component in said resin composition layer is determined to be 100% by mass.

### Claim 9 (depends on 8)

The resin sheet according to claim 8, wherein the inorganic filler has an average particle diameter of 0.05 μm to 0.35 μm.

### Claim 10 (depends on 8)

The resin sheet according to claim 8, wherein a product of a specific surface area, in m2/g, and a true density, in g/cm3, of the inorganic filler is 0.1 to 77.

### Claim 11 (depends on 1)

An insulating layer of a printed wiring board, prepared by curing a resin sheet according to claim 1.

### Claim 12 (depends on 11)

The insulating layer according to claim 11, wherein said insulating layer is contained in a printed wiring board comprising a first conductive layer and a second conductive layer, and said insulating layer insulates said first conductive layer from said second conductive layer and has a thickness of 6 μm or less between said first conductive layer and said second conductive layer.

### Claim 13 (depends on 1)

A printed wiring board, comprising:
a first conductive layer,
a second conductive layer, and
an insulating layer that insulates said first conductive layer from said second conductive layer and has a thickness of 6 μm or less between said first conductive layer and said second conductive layer,
wherein
said insulating layer is a cured product of said resin composition layer of a resin sheet according to claim 1.

### Claim 14 (depends on 13)

A semiconductor device, comprising a printed wiring board according to claim 13.

### Claim 15 (depends on 3)

The resin sheet according to claim 3, wherein said resin composition layer has a thickness of 15 μm or less.

### Claim 16 (depends on 3)

The resin sheet according to claim 3, wherein said resin composition layer has a lowest melt viscosity of 1000 poise or more.

### Claim 17 (depends on 3)

The resin sheet according to claim 3, wherein said resin composition layer contains an epoxy resin and a curing agent.

### Claim 18 (depends on 3)

The resin sheet according to claim 3, wherein
said resin composition layer contains an inorganic filler in an amount of 50% by mass or more when a nonvolatile component in said resin composition layer is determined to be 100% by mass.

### Claim 19 (depends on 18)

The resin sheet according to claim 18, wherein said inorganic filler has an average particle diameter of 0.05 μm to 0.35 μm.

### Claim 20 (depends on 18)

The resin sheet according to claim 18, wherein a product of a specific surface area, in m2/g, and a true density, in g/cm3, of the inorganic filler is 0.1 to 77.

### Claim 21 (depends on 3)

An insulating layer of a printed wiring board, prepared by curing a resin sheet according to claim 3.

### Claim 22 (depends on 21)

The insulating layer according to claim 21, wherein said insulating layer is contained in a printed wiring board comprising a first conductive layer and a second conductive layer, and said insulating layer insulates said first conductive layer from said second conductive layer and has a thickness of 6 μm or less between said first conductive layer and said second conductive layer.

### Claim 23 (depends on 3)

A printed wiring board, comprising:
a first conductive layer,
a second conductive layer, and
an insulating layer that insulates said first conductive layer from said second conductive layer and has a thickness of 6 μm or less between said first conductive layer and said second conductive layer,
wherein
said insulating layer is a cured product of the resin composition layer of a resin sheet according to claim 3.

### Claim 24 (depends on 23)

A semiconductor device, comprising the printed wiring board according to claim 23.