# US 2017/0290146 A1 · Wired circuit board and producing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0290146 A1 - Document ID: US20170290146A1 - Status: Published application - Kind: A1 - Application number: 15/463,538 - Filed: 2017-03-20 - Published: 2017-10-05 - Earliest claimed: 2016-03-30 - Assignees: Nitto Denko Corporation - Applicants: Nitto Denko Corporation - Inventors: Yuu SUGIMOTO; Yoshito FUJIMURA; Hiroyuki TANABE - Web page: https://patentgrep.com/patent/US20170290146A1 ## CPC - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H05K 3/064: {Photoresists} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 3/4679: {Aligning added circuit layers or via connections relative to previous circuit layers} - H05K 3/0008: {for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015)} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)} - H05K 2201/09227: Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting - H05K 2201/09272: Layout details of angles or corners - H05K 2203/0557: Non-printed masks - H05K 2203/056: Using an artwork, i.e. a photomask for exposing photosensitive layers - H05K 2203/0562: Details of resist - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist. ## Claims ### Claim 1 A method for producing a wired circuit board including an insulating layer and a conductive pattern, the method comprising the steps of: a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided at least on the inclination face of the insulating layer; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a light shield portion of a photomask is disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion; and a step (6), in which the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist, wherein the inclination face has a generally are shape when viewed from the top, in the step (4), the reflected light reflected at the metal thin film corresponding to the are is focused on the photoresist corresponding to the center of the virtual circle along the arc, and in the step (4), the light shield portion of the photomask is disposed to deviate from the center, and to overlap with at least the virtual circle. ### Claim 2 (depends on 1) The method for producing a wired circuit board according to claim 1, wherein the conductive pattern does not pass through the center but passes through the virtual circle. ### Claim 3 (depends on 1) The method for producing a wired circuit board according to claim 1, wherein the conductive pattern is partially cut out to form a cutout, and the cutout overlaps with the center when viewed from the top. ### Claim 4 (depends on 1) The method for producing a wired circuit board according to claim 1, wherein the outer shape of the conductive pattern includes the center when viewed from the top, and the conductive pattern has an opening including the center. ### Claim 5 (depends on 1) The method for producing a wired circuit board according to claim 1, wherein in the step (6), the conductive pattern is provided above and below the insulating layer. ### Claim 6 (depends on 1) The method for producing a wired circuit board according to claim 1, wherein the wired circuit board further includes a metal supporting board, and in the step (6), the conductive pattern is provided on the metal supporting board. ### Claim 7 A method for producing a wired circuit board including an insulating layer and a conductive pattern, the method comprising the steps of: a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a conductive layer is provided at least on the inclination face of the insulating layer; a step (3), in which a photoresist is provided on the surface of the conductive layer; a step (4), in which a light shield portion of a photomask is disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the photoresist other than the first portion is removed so as to leave the first portion of the photoresist, and a step (6), in which the conductive layer exposed from the photoresist is removed to form the conductive pattern, wherein the inclination face has a generally arc shape when viewed from the top, in the step (4), light reflected at the conductive layer corresponding to the arc is focused on the photoresist corresponding to the center of the virtual circle along the arc, and in the step (4), the light shield portion of the photomask is disposed so as to deviate from the center, and to overlap with at least the virtual circle. ### Claim 8 (depends on 7) The method for producing a wired circuit board according to claim 7, wherein the conductive pattern does not pass through the center but passes through the virtual circle. ### Claim 9 (depends on 7) The method for producing a wired circuit board according to claim 7, wherein the conductive pattern is partially cut out to form a cutout, and the cutout overlaps with the center when viewed from the top. ### Claim 10 (depends on 7) The method for producing a wired circuit board according to claim 7, wherein the outer shape of the conductive pattern includes the center when viewed from the top, and the conductive pattern has an opening including the center ### Claim 11 (depends on 7) The method for producing a wired circuit board according to claim 7, wherein in the step (6), the conductive pattern is provided above and below the insulating layer. ### Claim 12 (depends on 7) The method for producing a wired circuit board according to claim 7, wherein the wired circuit board further includes a metal supporting board, and in the step (6), the conductive pattern is provided on the metal supporting board. ### Claim 13 A wired circuit board comprising a conductive pattern and an insulating layer having an inclination face, wherein the inclination face has a generally arc shape when viewed from the top, and the conductive pattern has an inner circle portion that deviates from the center of the virtual circle along the arc and is disposed in at least the virtual circle.