# US 2017/0290144 A1 · Wiring board manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0290144 A1 - Document ID: US20170290144A1 - Status: Published application - Kind: A1 - Application number: 15/465,895 - Filed: 2017-03-22 - Published: 2017-10-05 - Earliest claimed: 2016-03-30 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: YOSHIYUKI HIROSHIMA; AKIKO MATSUI; Mitsuhiko Sugane; Takahide Mukoyama; Tetsuro Yamada; Kohei Choraku - Web page: https://patentgrep.com/patent/US20170290144A1 ## CPC - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/043: {by using a moving tool for milling or cutting the conductive material} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards} - H05K 2201/09263: Meander - H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component - H05K 2201/09418: Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands. ## Claims ### Claim 1 A wiring board manufacturing method comprising: forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands. ### Claim 2 (depends on 1) The manufacturing method according to claim 1, wherein, in the removing, the conductor at the apex of at least part of the plurality of polygonal lands is removed by drilling. ### Claim 3 (depends on 2) The manufacturing method according to claim 2, wherein the wiring board includes a plurality of wiring layers in the product section and the waste board section, and in the forming, the conductor pattern is included in at least two of the plurality of wiring layers. ### Claim 4 (depends on 3) The manufacturing method according to claim 3, wherein, in the forming, a conductor pattern is included in at least one of the plurality of wiring layers, the conductor pattern in which the plurality of polygonal lands are arranged so as to be shifted in the first direction and the second direction with respect to the plurality of polygonal lands arranged on another wiring layer. ### Claim 5 (depends on 4) The manufacturing method according to claim 4, wherein, in the removing, a conductor at the apex of at least part of the plurality of polygonal lands arranged on at least one of the wiring layers is removed by the drilling. ### Claim 6 (depends on 5) The manufacturing method according to claim 5, wherein, in the removing, the conductor at the apex of at least part of the plurality of polygonal lands arranged on the other wiring layer is further removed by the drilling. ### Claim 7 (depends on 3) The manufacturing method according to claim 3, wherein, in the forming, a conductor pattern is formed in a first wiring layer of the plurality of wiring layers, the conductor pattern in which the plurality of polygonal lands are cyclically arranged along the first direction and the second direction, a conductor pattern is formed on a second wiring layer of the plurality of wiring layers, the conductor pattern in which the plurality of polygonal lands are cyclically arranged so as to be shifted in the first direction and the second direction with respect to the plurality of polygonal lands arranged in the first wiring layer by a shift amount corresponding to a half of a repetition cycle of the plurality of polygonal lands, a conductor pattern is formed on a third wiring layer of the plurality of wiring layers, the conductor pattern in which the plurality of polygonal lands are cyclically arranged so as to be shifted in the first direction and the second direction with respect to the plurality of polygonal lands arranged in the first wiring layer by a shift amount corresponding to a quarter of the repetition cycle of the plurality of polygonal lands, and a conductor pattern is formed on a fourth wiring layer of the plurality of wiring layers, the conductor pattern in which the plurality of polygonal lands are cyclically arranged so as to be shifted in the first direction and the second direction with respect to the plurality of polygonal lands arranged in the first wiring layer by a shift amount corresponding to a third quarter of the repetition cycle of the plurality of lands, and in the removing, the conductor at the apex of at least part of the plurality of polygonal lands arranged on each of the first wiring layer to the fourth wiring layer is removed by forming through holes by the drilling. ### Claim 8 (depends on 1) The manufacturing method according to claim 1, wherein each of the plurality of polygonal lands has a quadrangular shape. ### Claim 9 (depends on 1) The manufacturing method according to claim 1, wherein each of the plurality of polygonal lands has a triangular shape. ### Claim 10 A wiring board manufacturing method comprising: forming a conductor pattern in a first wiring layer of a waste board section of a wiring board including a product section and the waste board section and including a plurality of wiring layers in the product section and the waste board section, the conductor pattern including a slit in a zigzag pattern extending in a first direction; and forming a conductor pattern on a second wiring layer of the waste board section, the conductor pattern including a slit in a zigzag pattern shifted in the first direction with respect to the zigzag pattern of the slit in the first wiring layer and extending in the first direction. ### Claim 11 A wiring board manufacturing method comprising: forming a conductor pattern in a first wiring layer of a waste board section of a wiring board including a product section and the waste board section and having a plurality of wiring layers in the product section and the waste board section, the conductor pattern including a first slit in a zigzag pattern extending in a first direction and a second slit in a zigzag pattern extending in a second direction crossing the first direction; and forming a conductor pattern in a second wiring layer of the waste board section, the conductor pattern including a third slit in a zigzag pattern shifted in the first direction with respect to the zigzag pattern of the first slit and extending in the first direction and a fourth slit in a zigzag pattern shifted in the second direction with respect to the zigzag pattern of the second slit and extending in the second direction.