# US 2017/0290141 A1 · Conductive-layer-integrated flexible printed circuit board

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- Number: US 2017/0290141 A1
- Document ID: US20170290141A1
- Status: Published application
- Kind: A1
- Application number: 15/629,504
- Filed: 2017-06-21
- Published: 2017-10-05
- Earliest claimed: 2012-07-18
- Assignees: Kaneka Corporation
- Applicants: Kaneka Corporation
- Inventors: Masayoshi Kido; Yoshihide Sekito
- Web page: https://patentgrep.com/patent/US20170290141A1

## CPC

- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- C09D 5/004: {Reflecting paints; Signal paints}
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 2201/012: Flame-retardant; Preventing of inflammation
- H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

## Claims

### Claim 1

A conductive-layer-integrated flexible printed circuit board, comprising:
(A) an electromagnetic-shielding conductive layer;
(B) an insulator film; and
(C) a wiring-pattern-equipped film,
(A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order,
(B) the insulator film having a thickness of from 5 μm to 100 μm containing at least (a) a binder polymer and (b) a black coloring agent containing a metal complex oxide or an organic pigment and having a reflectance of 5% or higher in a reflective range within an infrared range,
wherein (B) the insulator film contains (c) a flame retarder that is substantially undissolvable in an organic solvent, the flame retarder being selected from at least one member of the group consisting of phosphinate, a melamine cyanurate, and a boehmite aluminum hydroxide,
and wherein (A) the electromagnetic-shielding conductive layer is (A-1) a film, (A-2) a paste, or (A-3) a thin metal film.

### Claim 2

(canceled)

### Claim 3 (depends on 1)

The conductive-layer-integrated flexible printed circuit board according to claim 1,
wherein
(B) the insulator film includes a resin composition containing (d) a thermosetting resin.

### Claim 4 (depends on 1)

The conductive-layer-integrated flexible printed circuit board according to claim 1,
wherein
(B) the insulator film includes a photosensitive resin composition containing (e) a photopolymerization initiator.

### Claim 5 (depends on 1)

The conductive-layer-integrated flexible printed circuit board according to claim 1,
wherein
(A) the electromagnetic-shielding conductive layer contains (f) at least one element selected from the group consisting of silver, copper, aluminum, and nickel.

### Claim 6 (depends on 1)

The conductive-layer-integrated flexible printed circuit board according to claim 1,
wherein
(A) the electromagnetic-shielding conductive layer contains (f) at least two elements selected from the group consisting of silver, copper, aluminum, and nickel.