# US 2017/0288678 A1 · Oven controlled crystal oscillator device cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288678 A1 - Document ID: US20170288678A1 - Status: Published application - Kind: A1 - Application number: 15/090,433 - Filed: 2016-04-04 - Published: 2017-10-05 - Earliest claimed: 2016-04-04 - Assignees: Ciena Corporation - Inventors: Kevin Estabrooks; Daniel Rivaud; Adrianus Van Gaal - Web page: https://patentgrep.com/patent/US20170288678A1 ## CPC - H03K 7/08: Duration or width modulation {; Duty cycle modulation} - H03L 1/022: {by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature (H03L1/021 takes precedence)} - H03L 1/04: Constructional details for maintaining temperature constant - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H03L: AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES (generation of oscillations H03B) ## Abstract A device cover for temperature control of a component device includes at least one heating element enclosed using the device cover, and multiple sections. Each section is located at a distinct location on the device cover and includes a reflection angle for the distinct location. The reflection angle is configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element. ## Claims ### Claim 1 A device cover for temperature control of a component device, comprising: at least one heating element enclosed using the device cover; and a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element. ### Claim 2 (depends on 1) The device cover of claim 1, the plurality of sections configured to: enclose, in conjunction with a substrate configured to mount the component device and the at least one heating element, the component device and the at least one heating element, wherein enclosing the component device reduces convective heat transfer and radiated heat transfer away from the component device. ### Claim 3 (depends on 2) The device cover of claim 2, wherein the device cover is mounted on the substrate and comprises a parabolic-shaped portion. ### Claim 4 (depends on 1) The device cover of claim 1, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element toward a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally selective material. ### Claim 5 (depends on 1) The device cover of claim 1, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element away from a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally non-absorptive material. ### Claim 6 (depends on 1) The device cover of claim 1, wherein the at least one heating element comprises a first heating element and a second heating element, and wherein the plurality of sections comprises: a first portion of the device cover adapted to reflect a first plurality of heat rays from the first heating element to the component device; and a second portion of the device cover adapted to reflect a second plurality of heat rays from the second heating element to the component device. ### Claim 7 (depends on 6) The device cover of claim 6, wherein the second portion of the device cover is disposed at a relative position to the component device such that any heat ray along a trace from the first heating element to any point on the second portion of the device cover is captured by the component device before reaching the second portion of the device cover. ### Claim 8 An electro/opto-mechanical assembly for temperature control of a component device, comprising: at least one heating element in proximity of the component device; and a device cover having a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element enclosed using the device cover. ### Claim 9 (depends on 8) The electro/opto-mechanical assembly of claim 8, further comprising: a substrate configured to mount the component device and the at least one heating element, wherein the plurality of sections is further configured to enclose, in conjunction with the substrate, the component device and the at least one heating element, and wherein enclosing the component device reduces convective heat transfer and radiated heat transfer away from the component device. ### Claim 10 (depends on 9) The electro/opto-mechanical assembly of claim 9, wherein the device cover is mounted on the substrate and comprises a parabolic-shaped portion. ### Claim 11 (depends on 8) The electro/opto-mechanical assembly of claim 8, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element toward a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally selective material. ### Claim 12 (depends on 8) The electro/opto-mechanical assembly of claim 8, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element away from a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally non-absorptive material. ### Claim 13 (depends on 8) The electro/opto-mechanical assembly of claim 8, wherein the at least one heating element comprises a first heating element and a second heating element, and wherein the plurality of sections comprises: a first portion of the device cover adapted to reflect a first plurality of heat rays from the first heating element to the component device; and a second portion of the device cover adapted to reflect a second plurality of heat rays from the second heating element to the component device. ### Claim 14 (depends on 13) The electro/opto-mechanical assembly of claim 13, wherein the second portion of the device cover is disposed at a relative position to the component device such that any heat ray along a trace from the first heating element to any point on the second portion of the device cover is captured by the component device before reaching the second portion of the device cover. ### Claim 15 A method for temperature control of a component device, comprising: providing a device cover having a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from at least one heating element enclosed using the device cover; and mounting, on a substrate, the device cover, the component device, and the at least one heating element. ### Claim 16 (depends on 15) The method of claim 15, further comprising: enclosing, using the device cover and the substrate, the component device and the at least one heating element, wherein enclosing the component device reduces convective heat transfer and radiated heat transfer away from the component device. ### Claim 17 (depends on 15) The method of claim 15, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element toward a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally selective material. ### Claim 18 (depends on 15) The method of claim 15, wherein reflecting heat to the component device comprises: directing a heat ray from the least one heating element away from a pre-determined surface region of the component device, wherein the pre-determined surface region is coated with a thermally non-absorptive material. ### Claim 19 (depends on 15) The method of claim 15, wherein the at least one heating element comprises a first heating element and a second heating element, and wherein the plurality of sections comprises: a first portion of the device cover adapted to reflect a first plurality of heat rays from the first heating element to the component device; and a second portion of the device cover adapted to reflect a second plurality of heat rays from the second heating element to the component device. ### Claim 20 (depends on 19) The method of claim 19, wherein the second portion of the device cover is disposed at a relative position to the component device such that any heat ray along a trace from the first heating element to any point on the second portion of the device cover is captured by the component device before reaching the second portion of the device cover.