# US 2017/0288642 A1 · Piezoelectric package-integrated contour mode filter devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288642 A1 - Document ID: US20170288642A1 - Status: Published application - Kind: A1 - Application number: 15/088,987 - Filed: 2016-04-01 - Published: 2017-10-05 - Earliest claimed: 2016-04-01 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Feras EID; Georgios C. DOGIAMIS; Valluri R. RAO; Adel A. ELSHERBINI; Johanna M. SWAN; Telesphor KAMGAING; Vijay K. NAIR - Web page: https://patentgrep.com/patent/US20170288642A1 ## CPC - H03H 9/54: comprising resonators of piezoelectric or electrostrictive material (comprising resonators using surface acoustic waves H03H9/64) - H03H 9/05: Holders or supports - H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)} - H03H 9/17: having a single resonator (crystal tuning forks H03H9/21) - H03H 9/173: {Air-gaps} - H03H 9/2463: {Clamped-clamped beam resonators} - H03H 2009/02503: {Breath-like, e.g. Lam? mode, wine-glass mode} - H03H 2009/155: {using MEMS techniques} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes. ## Claims ### Claim 1 A filtering device, comprising: a vibrating stack that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material, wherein the vibrating stack expands and contracts laterally in a plane of an organic substrate having organic layers in response to application of an electrical signal to the piezoelectric material between the first and second electrodes. ### Claim 2 (depends on 1) The filtering device of claim 1, wherein the filtering device is integrated with the organic substrate which is fabricated with panel level processing. ### Claim 3 (depends on 2) The filtering device of claim 2, wherein the filtering device is positioned above a cavity of the organic substrate to allow vibrations of the stack. ### Claim 4 (depends on 2) The filtering device of claim 2, wherein the first and second electrodes are biased with an electrical signal having a frequency approximately equal to a mechanical resonant frequency of the stack containing the electrodes and the piezoelectric material in order to operate the filtering device at resonance to maximize electrical admittance. ### Claim 5 (depends on 1) The filtering device of claim 1, wherein the vibrating stack has any type of in-plane shape defined by lithography during fabrication of the panel level organic substrate, wherein each shape is associated with a corresponding resonant frequency. ### Claim 6 (depends on 1) The filtering device of claim 1, wherein the filtering device comprises a contour mode resonator with the resonator having a first static unexcited mode and an associated first shape and also a second excited resonant mode and an associated different second shape. ### Claim 7 (depends on 6) The filtering device of claim 6, wherein the contour mode resonator comprises a single port design with the first electrode being coupled to a first electrical connection of the organic substrate in proximity to a first end of a cavity of the organic substrate and the second electrode being coupled to a second electrical connection of the organic substrate in proximity to a second end of the cavity. ### Claim 8 (depends on 1) The filtering device of claim 1, wherein the contour mode resonator comprises a single port design with the first and second electrodes being coupled to first and second electrical connections respectively of the organic substrate in proximity to a first end of a cavity of the organic substrate. ### Claim 9 A package substrate comprising: a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate; a cavity formed in the package substrate; and a piezoelectric device integrated within the package substrate, the piezoelectric device including an input electrode, an output electrode, and a ground electrode in contact with a piezoelectric material, wherein the piezoelectric device oscillates in response to application of an input electrical signal between the input and ground electrodes. ### Claim 10 (depends on 9) The package substrate of claim 9, wherein the piezoelectric device is positioned above the cavity to allow oscillations of the piezoelectric device leading to the generation of an output electrical signal between the output electrode and the ground electrode. ### Claim 11 (depends on 9) The package substrate of claim 9, wherein the input and ground electrodes are biased with an input electrical signal having a frequency approximately equal to a mechanical resonant frequency of the piezoelectric device in order to operate at resonance. ### Claim 12 (depends on 9) The package substrate of claim 9, wherein the piezoelectric device comprises a dual port design with the input electrode being coupled to a first electrical connection in proximity to a first end of the cavity and the output electrode being coupled to a second electrical connection in proximity to a second end of the cavity. ### Claim 13 A filtering device comprising: an input electrode for receiving an input electrical signal; a first piezoelectric layer in contact with the input electrode; a ground electrode in contact with the first piezoelectric layer; a second piezoelectric layer in contact with the ground electrode; and an output electrode in contact with the second piezoelectric layer, wherein the filtering device oscillates within an organic substrate in response to application of the input electrical signal between the input electrode and ground electrode. ### Claim 14 (depends on 13) The filtering device of claim 13, wherein the filtering device is integrated with the organic substrate which includes organic layers. ### Claim 15 (depends on 14) The filtering device of claim 14, wherein the filtering device is positioned above a cavity of the organic substrate to allow oscillations of the filtering device leading to the generation of an output electrical signal between the output electrode and the ground electrode. ### Claim 16 (depends on 13) The filtering device of claim 13, wherein the input and ground electrodes are biased with an input electrical signal having a frequency approximately equal to a mechanical resonant frequency of the filtering device in order to operate at resonance. ### Claim 17 (depends on 13) The filtering device of claim 13, wherein the piezoelectric filtering device comprises a dual port design with the input electrode being coupled to a first electrical connection in proximity to a first end of the cavity and the output electrode being coupled to a second electrical connection in proximity to a second end of the cavity. ### Claim 18 A computing device comprising: at least one processor to process data; and a package substrate coupled to the at least one processor, the package substrate includes a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes a piezoelectric filtering device having a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material, wherein the piezoelectric filtering device expands and contracts laterally in a plane of the package substrate in response to application of an electrical signal between the first and second electrodes. ### Claim 19 (depends on 18) The computing device of claim 18, wherein the filtering device is integrated with the organic package substrate having organic layers. ### Claim 20 (depends on 18) The computing device of claim 18, further comprising: a printed circuit board coupled to the package substrate.