# US 2017/0288641 A1 · Baw filter and method for manufacturing the same

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- Number: US 2017/0288641 A1
- Document ID: US20170288641A1
- Status: Published application
- Kind: A1
- Application number: 15/420,722
- Filed: 2017-01-31
- Published: 2017-10-05
- Earliest claimed: 2016-04-04
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Han Tae KIM; Hyun Min HWANG; Jong Beom KIM; Seung Joo SHIN
- Web page: https://patentgrep.com/patent/US20170288641A1

## CPC

- H03H 9/46: Filters (multiple-port electromechanical filters H03H9/70)
- H03H 9/706: {Duplexers}
- H03H 3/007: for the manufacture of electromechanical resonators or networks
- H03H 9/0514: {consisting of mounting pads or bumps}
- H03H 9/1007: {for bulk acoustic wave [BAW] devices}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

A bulk acoustic wave (BAW) filter includes: a substrate including a first mounting region and a second mounting region which are spaced apart from each other; a first fixing member disposed adjacent to the first mounting region; a second fixing member disposed adjacent to the second mounting region; a Tx filter mounted on the first mounting region and fixed by the first fixing member; and an Rx filter mounted on the second mounting region and fixed by the second fixing member.

## Claims

### Claim 1

A bulk acoustic wave (BAW) filter comprising:
a substrate comprising a first mounting region and a second mounting region which are spaced apart from each other;
a first fixing member disposed adjacent to the first mounting region;
a second fixing member disposed adjacent to the second mounting region;
a Tx filter mounted on the first mounting region and fixed by the first fixing member; and
an Rx filter mounted on the second mounting region and fixed by the second fixing member.

### Claim 2 (depends on 1)

The BAW filter of claim 1, wherein:
the first fixing member fixes two sides of the Tx filter which are not adjacent to each other; and
the second fixing member fixes two sides of the Rx filter which are not adjacent to each other.

### Claim 3 (depends on 1)

The BAW filter of claim 1, wherein:
the first fixing member fixes two corners of the Tx filter which are not adjacent to each other; and
the second fixing member fixes two corners of the Rx filter which are not adjacent to each other.

### Claim 4 (depends on 1)

The BAW filter of claim 1, wherein:
the first fixing member fixes corners of the Tx filter; and
the second fixing member fixes corners of the Rx filter.

### Claim 5 (depends on 1)

The BAW filter of claim 1, wherein:
pads formed on the first mounting region are electrically connected to respective pads on the Tx filter; and
pads formed on the second mounting region are electrically connected to respective pads on the Rx filter.

### Claim 6 (depends on 1)

The BAW filter of claim 1, wherein:
the first fixing member comprises a conductive material; and
the Tx filter comprises a first ground electrode formed on a side of the Tx filter and electrically connected to the first fixing member.

### Claim 7 (depends on 1)

The BAW filter of claim 1, wherein:
the second fixing member includes a conductive material; and
the Rx filter comprises a second ground electrode formed on a side of the Rx filter and electrically connected to the second fixing member.

### Claim 8 (depends on 1)

The BAW filter of claim 1, further comprising a molding part formed on the substrate and surrounding the Tx filter and the Rx filter.

### Claim 9 (depends on 1)

The BAW filter of claim 1, wherein the first fixing member and the second fixing member comprise bodies having a bracket form.

### Claim 10 (depends on 1)

The BAW filter of claim 1, wherein the first fixing member and the second fixing member comprise bodies having a rectangular form.

### Claim 11

A method to manufacture a bulk acoustic wave (BAW) filter, the method comprising:
preparing a substrate comprising
a first mounting region and a second mounting region which are spaced apart from each other,
a first fixing member disposed adjacent to the first mounting region, and
a second fixing member disposed adjacent to the second mounting region;
mounting a Tx filter on the first mounting region such that the Tx filter is fixed by the first fixing member;
mounting an Rx filter on the second mounting region such that the Rx filter is fixed by the second fixing member; and
performing soldering for the substrate.

### Claim 12 (depends on 11)

The method of claim 11, wherein:
in the mounting of the Tx filter, the first fixing member fixes two sides of the Tx filter which are not adjacent to each other; and
in the mounting of the Rx filter, the second fixing member fixes two sides of the Rx filter which are not adjacent to each other.

### Claim 13 (depends on 11)

The method of claim 11, wherein:
in the mounting of the Tx filter, the first fixing member fixes two corners of the Tx filter which are not adjacent to each other; and
in the mounting of the Rx filter, the second fixing member fixes two corners of the Rx filter which are not adjacent to each other.

### Claim 14 (depends on 11)

The method of claim 11, wherein:
in the mounting of the Tx filter, the first fixing member fixes all corners of the Tx filter; and
in the mounting of the Rx filter, the second fixing member fixes all corners of the Rx filter.

### Claim 15 (depends on 11)

The method of claim 11, wherein the performing of the soldering for the substrate comprises:
electrically connecting pads on the first mounting region to pads on the Tx filter, by solder; and
electrically connecting pads on the second mounting region to pads on the Rx filter, by the solder.

### Claim 16 (depends on 11)

The method of claim 11, wherein the performing of the soldering for the substrate comprises:
electrically connecting the first fixing member and a first ground electrode, formed on a side of the Tx filter, to each other.

### Claim 17 (depends on 11)

The method of claim 11, wherein the performing of the soldering for the substrate comprises:
electrically connecting the second fixing member and a second ground electrode, formed on a side of the Rx filter, to each other.

### Claim 18 (depends on 11)

The method of claim 11, further comprising forming a molding part on the substrate such that the molding part surrounds the Tx filter and the Rx filter.
