# US 2017/0288522 A1 · Piezoelectric vibration component and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288522 A1 - Document ID: US20170288522A1 - Status: Published application - Kind: A1 - Application number: 15/631,451 - Filed: 2017-06-23 - Published: 2017-10-05 - Earliest claimed: 2015-01-08 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Kazuyuki Noto; Keiichi Kami; Hidekazu Oishibashi - Web page: https://patentgrep.com/patent/US20170288522A1 ## CPC - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 9/0519: {for cantilever (H03H9/1021 takes precedence)} - H03H 9/1021: {the BAW device being of the cantilever type} - H10W 76/60: Seals - H03H 2003/022: {the resonators or networks being of the cantilever type} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface. ## Claims ### Claim 1 A vibration component comprising: a substrate having a principal surface; a piezoelectric vibrator disposed on the principal surface of the substrate; an insulating film disposed on the principal surface of the substrate; a lid having an edge portion; and a first insulating bonding layer and a second insulating bonding layer interposed between the lid and the substrate, wherein the first and second insulating bonding layers are joined together and disposed between the edge portion of the lid and the insulating film so as to seal the piezoelectric vibrator between the lid and the principal surface of the substrate. ### Claim 2 (depends on 1) A piezoelectric vibration component according to claim 1, wherein the edge portion of the lid has a same planar shape as the insulating film. ### Claim 3 (depends on 2) A piezoelectric vibration component according to claim 2, wherein the first insulating bonding layer has the same planar shape as the insulating film. ### Claim 4 (depends on 3) A piezoelectric vibration component according to claim 3, wherein the second insulating bonding layer has the same planar shape as the first insulating bonding layer. ### Claim 5 (depends on 1) A piezoelectric vibration component according to claim 1, wherein the insulating film includes a glass film. ### Claim 6 (depends on 1) A piezoelectric vibration component according to claim 1, wherein the lid has a recess opening facing the principal surface of the substrate, the edge portion extends around a periphery of recess opening, and the edge portion has a flange shape that extends outwardly from the edge portion. ### Claim 7 A method for manufacturing a piezoelectric vibration component, comprising: mounting a piezoelectric vibrator on a principal surface of a substrate; forming an insulating film on the principal surface of the substrate, the insulating film at least surrounding the piezoelectric vibrator; forming a first insulating bonding layer on an edge portion of a lid; superposing a second insulating bonding layer on the insulating film; and joining the first insulation bonding layer to the second insulating bonding layer to seal the piezoelectric vibrator between the lid and the principal surface of the substrate. ### Claim 8 (depends on 7) The method for manufacturing a piezoelectric vibration component according to claim 7, further comprising roughly curing the first insulating bonding layer before joining the first insulation bonding layer to the second insulating bonding layer. ### Claim 9 (depends on 7) The method for manufacturing a piezoelectric vibration component according to claim 7, further comprising roughly curing the first insulation bonding layer and the second insulating bonding layer before joining the first insulation bonding layer to the second insulating bonding layer. ### Claim 10 (depends on 7) The method for manufacturing a piezoelectric vibration component according to claim 7, further comprising forming the insulating film to have a same planar shape as the edge portion of the lid. ### Claim 11 (depends on 10) The method for manufacturing a piezoelectric vibration compnent according to claim 10, further comprising forming the insulating film to have a same planar shape as the first insulating bonding layer and second insulating bonding layer. ### Claim 12 (depends on 7) The method for manufacturing a piezoelectric vibration component according to claim 7, further comprising forming the first insulating bonding layer on the edge portion of the lid in advance of superposing the second insulating bonding layer on the insulating film, such that the first insulating bonding layer enters gaps between projections and depressions on a surface of the edge portion to enhance wettability or affinity of the surface of the edge portion of the lid. ### Claim 13 A method for manufacturing a piezoelectric vibration component, comprising: mounting a piezoelectric vibrator on a principal surface of a substrate; forming an insulating film on the principal surface of the substrate to surround the piezoelectric vibrator; forming a first insulating bonding layer at an edge portion of a lid; superposing a second insulating bonding layer on the first insulating bonding layer; and joining the first and second insulating bonding layers to the insulating film to seal the piezoelectric vibrator in a space between the lid and the principal surface the substrate. ### Claim 14 (depends on 13) The method for manufacturing a piezoelectric vibration component according to claim 13, further comprising roughly curing the first insulating bonding layer before joining the first insulation bonding layer to the second insulating bonding layer. ### Claim 15 (depends on 13) The method for manufacturing a piezoelectric vibration component according to claims 13, further comprising curing the first insulation bonding layer and the second insulating bonding layer before joining the first insulation bonding layer to the second insulating bonding layer. ### Claim 16 (depends on 13) The method for manufacturing a piezoelectric vibration component according to claims 13, further comprising forming the insulating film to have a same planar shape as the edge portion of the lid. ### Claim 17 (depends on 16) The method for manufacturing a piezoelectric vibration component according to claims 16, further comprising forming the insulating film to have a same planar shape as the first insulating bonding layer and the second insulating bonding layer. ### Claim 18 (depends on 13) The method for manufacturing a piezoelectric vibration component according to claim 13, further comprising forming the first insulating bonding layer on the edge portion of the lid in advance of joining the first and second insulating bonding layers to the insulating film, such that the first insulating bonding layer enters gaps between projections and depressions on a surface of the edge portion to enhance wettability or affinity of the surface of the edge portion of the lid.