# US 2017/0288367 A1 · Optical unit, fixing mechanism for optical unit, and semiconductor laser module

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- Number: US 2017/0288367 A1
- Document ID: US20170288367A1
- Status: Published application
- Kind: A1
- Application number: 15/622,897
- Filed: 2017-06-14
- Published: 2017-10-05
- Earliest claimed: 2014-12-25
- Assignees: Furukawa Electric Co., Ltd.
- Applicants: Furukawa Electric Co., Ltd.
- Inventors: Hidehiro Taniguchi; Junji Yoshida
- Web page: https://patentgrep.com/patent/US20170288367A1

## CPC

- H01S 5/02355: Fixing laser chips on mounts
- H01S 5/02251: using optical fibres
- H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches
- H01S 5/024: Arrangements for thermal management
- H01S 5/0683: by monitoring the optical output parameters
- H01S 5/4012: {Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms}
- H01S 5/4075: {Beam steering}
- H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings
- H01S 5/02253: using lenses
- H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
- H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)}
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

A circuit conductor is provided on a base. A semiconductor laser is connected to the circuit conductor. Cutout parts on which the circuit conductor is not formed are provided at, for example, the vicinity of the four corners of the base, and a hole is provided at each of the said portions. The holes penetrate the base. Fixing members are inserted through the holes. The fixing members are, for example, male threads. Since the head part of the fixing members is located in the cutout part, the fixing members and the circuit conductor are not in contact with each other. A platform has holes formed at portions corresponding to the holes in the optical unit and female threads formed on the inner surface. The fixing members and the platform are therefore joined. As a result, the optical unit is fixed to the platform.

## Claims

### Claim 1

An optical unit comprising:
a base; and
a semiconductor laser that is disposed on the base, wherein
holes through which fixing members can be inserted are formed on the base.

### Claim 2 (depends on 1)

The optical unit according to claim 1, wherein:
a lens that collimates light emitted from the semiconductor laser is joined to the optical unit.

### Claim 3 (depends on 1)

The optical unit according to claim 1, wherein:
a metal layer is exposed on a surface of the base around the hole and the metal layer is insulated from circuit patterns on the base.

### Claim 4 (depends on 1)

The optical unit according to claim 1, wherein:
the holes are disposed on both sides of the semiconductor laser.

### Claim 5

A fixing mechanism for an optical unit, wherein;
an optical unit including a base and a semiconductor laser disposed on the base, or an optical unit with a platform in which a platform is joined to the optical unit, is used;
holes through which fixing members can be inserted are formed on the base or the platform; and
the optical unit is fixed to the platform, a package, or a cooling device with the fixing members, or the optical unit with a platform is fixed to the package or the cooling device with the fixing members.

### Claim 6 (depends on 1)

A semiconductor laser module comprising:
the optical unit according to claim 1;
an optical fiber to which laser beams emitted from the semiconductor laser are coupled; and
a package that accommodates the optical unit, wherein:
the optical unit is directly or indirectly fixed to the package with the fixing members.

### Claim 7 (depends on 6)

The semiconductor laser module according to claim 6, further comprising:
a plurality of the optical units that are accommodated in the package;
a plurality of reflective mirrors that reflect laser beams emitted from each of the semiconductor lasers respectively; and
a condensing lens that condenses the laser beams reflected by the plurality of the reflective mirrors, wherein:
each of the plurality of the optical units can be individually attached or detached.

### Claim 8 (depends on 6)

The semiconductor laser module according to claim 6, wherein:
a thermo-conductive sheet is disposed on a bottom face of the base and the optical unit is in contact with a connection target via the thermo-conductive sheet.

### Claim 9 (depends on 6)

The semiconductor laser module according to claim 6, wherein:
the optical fiber is a multi-mode optical fiber.