# US 2017/0288109 A1 · Light emitting device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288109 A1 - Document ID: US20170288109A1 - Status: Published application - Kind: A1 - Application number: 15/613,951 - Filed: 2017-06-05 - Published: 2017-10-05 - Earliest claimed: 2013-12-19 - Assignees: Koninklijke Philips N.V. - Applicants: Koninklijke Philips N.V. - Inventors: Paul Dijkstra; Aernout Reints Bok; Pascal Johannes Theodorus Lambertus Oberndorff; Lu Fei Zhang; Boudewijn Ruben De Jong; Marcus Franciscus Donker - Web page: https://patentgrep.com/patent/US20170288109A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H 20/856: Reflecting means - H10H 20/036: {of packages} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16. ## Claims ### Claim 1 A packaged light emitting device comprising: a package comprising a body having a reflective surface, the package further comprising a leadframe; the leadframe having a raised portion and a lower portion, the raised portion being exposed through the reflective surface of the body to define at least one bonding area surrounded by the reflective surface; a mounting surface for a light emitting device die comprising a continuous surface formed of the at least one bonding area and the reflective surface, the lower portion of the leadframe being at least partially encased in the body; a conductive bond material covering the at least one bonding area; and the light emitting device die mounted to the at least one bonding area by the bond material, such that the reflective surface surrounds the light emitting device die. ### Claim 2 (depends on 1) The device of claim 1 wherein the at least one bonding area comprises at least one solder bonding area, wherein the bond material comprises a solder, and wherein the reflective surface resists solder so that the solder does not adhere to the reflective surface. ### Claim 3 (depends on 1) The device of claim 1 wherein: the leadframe is additionally exposed at the mounting surface to define at least one wire bonding area; and the mounting surface is of the reflective surface apart from the at least one bonding area and the at least one wire bonding area; the device further comprising at least one bonding wire connecting the die to the at least one wire bonding area. ### Claim 4 (depends on 1) The device of claim 1 wherein the mounting surface comprises a continuous planar surface formed of the at least one bonding area and the reflective surface. ### Claim 5 (depends on 1) The device of claim 1 wherein the body is in the form of a reflective cup. ### Claim 6 (depends on 1) The device of claim 1 wherein the body is flat. ### Claim 7 (depends on 1) The device of claim 1 wherein the bond material is a solder. ### Claim 8 A method of packaging a light emitting device comprising: providing a leadframe, the leadframe having a raised portion and a lower portion; molding a package body material around the leadframe so as to define a reflective surface as part of a package body, the raised portion being exposed through the reflective surface to define at least one bonding area surrounded by the reflective surface, the lower portion being at least partially encased in the package body; and mounting a light emitting device die to the at least one bonding area and electrically bonding electrodes of the die to the at least one bonding area, such that the reflective surface surrounds the light emitting device die. ### Claim 9 (depends on 8) The method of claim 8 wherein the reflective surface and the raised portion form a continuous planar surface beneath the light emitting device die. ### Claim 10 (depends on 8) The method of claim 8 wherein the at least one bonding area is at least one solder bonding area, and wherein the step of electrically bonding comprising bonding the electrodes of the die to the at least one solder bonding area with a solder. ### Claim 11 (depends on 10) The method of claim 10 wherein the reflective surface resists wetting by solder. ### Claim 12 (depends on 11) The method of claim 11 wherein mounting the light emitting device die to the at least one solder bonding area comprises: depositing solder on the at least one solder bonding area; and placing the light emitting device die on the solder over the mounting surface, wherein applying heat to melt solder reflows the solder to cover the at least one solder bonding area to attach the light emitting device die to the mounting surface. ### Claim 13 (depends on 11) The method of claim 11 wherein mounting the light emitting die to the at least one solder bonding area comprises: depositing solder bumps on the light emitting device die; and placing the light emitting device die and solder bumps on the at least one solder bonding area on the solder over the mounting surface, wherein applying heat to melt solder reflows the solder to cover the at least one solder bonding area to attach the light emitting die to the mounting surface. ### Claim 14 (depends on 8) The method of claim 8 wherein the leadframe is of copper or a copper alloy without any additional layers when the leadframe is introduced into a mold during the step of molding. ### Claim 15 (depends on 8) The method of claim 8 wherein the leadframe further comprises a layer of Ag, a layer of Au or a layer of NiAu on one or more surfaces of the leadframe. ### Claim 16 (depends on 8) The method of claim 8 further comprising, before the step of providing the leadframe: providing the leadframe of constant thickness, the leadframe having a first surface; and etching the first surface of the leadframe form the raised portion and the lower portion.