# US 2017/0288108 A1 · Light-emitting diode device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288108 A1 - Document ID: US20170288108A1 - Status: Published application - Kind: A1 - Application number: 15/507,767 - Filed: 2015-08-31 - Published: 2017-10-05 - Earliest claimed: 2014-09-01 - Assignees: OSRAM Opto Semiconductors GmbH - Applicants: OSRAM Opto Semiconductors GmbH - Inventors: Michael Schumann; Tobias Gebuhr; David Racz; Matthias Sperl - Web page: https://patentgrep.com/patent/US20170288108A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/32: electrically connecting electric components or wires to printed circuits - H10H 20/8506: {Containers} - H10H 20/8512: {Wavelength conversion materials} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/856: Reflecting means - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/10106: Light emitting diode [LED] - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 74/00: Encapsulations, e.g. protective coatings - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein the light-emitting diode is at least partly enclosed by molding by a potting compound. ## Claims ### Claim 1 An optoelectronic device, comprising: a printed circuit board, a light source arranged on a surface of the printed circuit board, the light source comprising at least one light-emitting diode electrically connected to the printed circuit board and forming at least one luminous face of the light source, and a potting compound molded to at least partly enclose the light emitting diode. ### Claim 2 (depends on 1) The optoelectronic device as claimed in claim 1, wherein the printed circuit board comprises an anchoring structure for anchoring the potting compound on the printed circuit board, such that the potting compound is anchored on the printed circuit board by the anchoring structure. ### Claim 3 (depends on 2) The optoelectronic device as claimed in claim 2, wherein the anchoring structure comprises at least one cutout in which potting compound is received. ### Claim 4 (depends on 3) The optoelectronic device as claimed in claim 3, wherein the cutout is a through hole. ### Claim 5 (depends on 2) The optoelectronic device as claimed in claim 2, wherein the anchoring structure comprises two opposite edges of the surface which are enclosed by molding by the potting compound. ### Claim 6 (depends on 1) The optoelectronic device as claimed in claim 1, wherein the potting compound comprises a mounting face for mounting of a component, wherein the mounting face is formed parallel to the surface. ### Claim 7 (depends on 1) The optoelectronic device as claimed in claim 1, wherein the surface comprises a potting-compound-free-section for mounting of a component. ### Claim 8 (depends on 6) The optoelectronic device as claimed in claim 6, wherein as component a lens mount is arranged on the mounting face. ### Claim 9 (depends on 1) The optoelectronic device as claimed in claim 1, wherein the potting compound comprises a reflector section for reflecting light emitted by the diode. ### Claim 10 A method for producing an optoelectronic device comprising: providing a printed circuit board; arranging a light source onto a surface of the printed circuit board, wherein the light source comprises at least one luminous face formed by at least one light-emitting diode; electrically connecting the light-emitting diode to the printed circuit board; and molding a potting compound to at least partly enclose the light-emitting diode. ### Claim 11 (depends on 10) The method as claimed in claim 10, further comprising: forming an anchoring structure on the printed circuit board to anchor the potting compound on the printed circuit board (101) before said molding, such that during said molding the potting compound is anchored onto the printed circuit board by means of the anchoring structure. ### Claim 12 (depends on 11) The method as claimed in claim 11, wherein the anchoring structure comprises at least one cutout which is formed on the printed circuit board, such that potting compound is received into the cutout during said molding. ### Claim 13 (depends on 10) The method as claimed in claim 10, further comprising: forming a mounting face for mounting of a component by the potting compound during said molding, wherein the mounting face is parallel to the surface. ### Claim 14 (depends on 10) The method as claimed in claim 10, wherein during said molding a section of the surface is kept free of the potting compound, such that after said molding the surface comprises a potting-compound-free-section for mounting of a component. ### Claim 15 (depends on 13) The method as claimed in claim 13, wherein as component a lens mount is arranged onto the mounting face. ### Claim 16 (depends on 10) The method as claimed in claim 10, further comprising: forming, during said molding, a reflector section by the Dotting compound to reflect light emitted by the diode. ### Claim 17 (depends on 7) The optoelectronic device as claimed in claim 7, wherein as component a lens mount is arranged on the potting-compound-free-section. ### Claim 18 (depends on 14) The method as claimed in claim 14, wherein as component a lens mount is arranged onto the potting-compound-free-section.