# US 2017/0288101 A1 · Led emission source for sequential drivers

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2017/0288101 A1
- Document ID: US20170288101A1
- Status: Published application
- Kind: A1
- Application number: 15/282,356
- Filed: 2016-09-30
- Published: 2017-10-05
- Earliest claimed: 2016-04-04
- Inventors: Yuriy Borisovich Sokolov
- Web page: https://patentgrep.com/patent/US20170288101A1

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8582: {characterised by their shape}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An LED emission source is described herein. While the LED emission source can include any suitable component, in some implementations it includes a substrate that includes an insulating heat conducting material. In some cases, the emission source further includes two or more LED crystal groups, multiple electrical contacts for a driver connection, with the electrical contacts being disposed at a front face of the substrate, and a metal heat radiator that includes a plate having a surface that includes a dielectric layer, wherein the dielectric layer is located on a back side of the metal heat radiator and is configured to provide heat exchange with the substrate, and wherein a number of the electrical contacts is one unit more than a number of the LED crystal groups. Other implementations are described.

## Claims

### Claim 1

An LED emission source, comprising:
a substrate, comprising an insulating heat conducting material;
two or more LED crystal groups;
electrical contacts for a driver connection, the electrical contacts being disposed at a front face of the substrate; and
a metal heat radiator comprising a plate having a surface that comprises a dielectric layer,
wherein the dielectric layer is located on a back side of the metal heat radiator and is configured to provide heat exchange with the substrate, and
wherein a number of the electrical contacts is one unit more than a number of the LED crystal groups.

### Claim 2 (depends on 1)

The LED emission source according to claim 1, wherein the insulating heat conducting material of the substrate comprises a ceramic having a breakdown voltage that is not less than 4 kW.

### Claim 3 (depends on 1)

The LED emission source according to claim 1, wherein the dielectric layer comprises a heat conducting prepreg having a breakdown voltage that is not worse than 4 kW.

### Claim 4 (depends on 1)

The LED emission source according to claim 1, wherein a distance from any current-carrying element of the substrate to an edge of the substrate is not less than 3 mm.

### Claim 5 (depends on 1)

The LED emission source according to claim 1, wherein a number of sequentially connected LED crystal groups is selected for use on the substrate with a connection to the contacts where general voltage supplied to the substrate is up to 300 V.

### Claim 6 (depends on 1)

The LED emission source according to claim 1, wherein the substrate further comprises an insulation collar.