# US 2017/0288086 A1 · Light emitting device and method of fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0288086 A1 - Document ID: US20170288086A1 - Status: Published application - Kind: A1 - Application number: 15/626,069 - Filed: 2017-06-16 - Published: 2017-10-05 - Earliest claimed: 2013-06-28 - Assignees: Seoul Semiconductor Co., Ltd. - Applicants: Seoul Semiconductor Co., Ltd. - Inventors: Hyuck Jung CHOI; Dae Hee KIM - Web page: https://patentgrep.com/patent/US20170288086A1 ## CPC - H10H 20/01: Manufacture or treatment - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H05B 33/12: Light sources with substantially two-dimensional [2D] radiating surfaces - H10H 20/8513: {having two or more wavelength conversion materials} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10H 20/036: {of packages} - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method of fabricating a light-emitting device including the steps of forming a first resin including a phosphor on a light-emitting diode chip mounted on a package body, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, correcting the color coordinates by forming a second resin on the first resin, and curing the first resin and the second resin after correcting the color coordinates, in which the first resin is not fully cured before measuring and correcting the color coordinates. ## Claims ### Claim 1 A method of fabricating a light-emitting device, the method comprising: forming a first resin comprising a phosphor on a light-emitting diode chip mounted on a package body; measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor; correcting the color coordinates by forming a second resin on the first resin; and curing the first resin and the second resin after correcting the color coordinates, wherein the first resin is not fully cured before measuring and correcting the color coordinates. ### Claim 2 (depends on 1) The method of claim 1, wherein correcting the color coordinates comprises mixing a phosphor-containing or phosphor-free second resin with the first resin. ### Claim 3 (depends on 1) The method of claim 1, wherein the first and second resins comprise the same material. ### Claim 4 (depends on 1) The method of claim 1, wherein the first and second resins comprise different materials. ### Claim 5 (depends on 1) The method of claim 1, wherein forming the first resin comprises: depositing the first resin on the light-emitting diode chip; and allowing the phosphor of the first resin to settle around the light-emitting diode chip after depositing the first resin on the light-emitting diode chip. ### Claim 6 (depends on 5) The method of claim 5, wherein the phosphor is allowed to settle for at least 30 minutes. ### Claim 7 (depends on 5) The method of claim 5, wherein the concentration of the phosphor gradually decreases towards an upper surface of the first resin. ### Claim 8 (depends on 1) The method of claim 1, further comprising partially curing the first resin after forming the first resin on the light-emitting diode chip. ### Claim 9 (depends on 8) The method of claim 8, further comprising fully curing the first resin and the second resin after correcting the color coordinates. ### Claim 10 (depends on 1) The method of claim 1, wherein an upper portion of a cavity of the package body is partially exposed from the first resin. ### Claim 11 (depends on 11) The method of claim 11, wherein the second resin is formed on the first resin in the cavity such that a molding section becomes coplanar with an upper surface of the cavity. ### Claim 12 A method of fabricating a light-emitting device, the method comprising: depositing a first resin comprising a phosphor on a light-emitting diode chip mounted on a package body; allowing the phosphor of the first resin to settle around the light-emitting diode chip after depositing the first resin on the light-emitting diode chip; measuring color coordinates of light emitted by combination of the light emitting diode chip and the phosphor; and correcting the color coordinates by forming a second resin on the first resin, wherein the concentration of the phosphor gradually decreases towards an upper surface of the first resin. ### Claim 13 (depends on 12) The method of claim 12, wherein correcting the color coordinates comprises mixing a phosphor-containing or phosphor-free second resin with the first resin. ### Claim 14 (depends on 12) The method of claim 12, further comprising curing the first resin and the second resin after correcting the color coordinates. ### Claim 15 (depends on 12) The method of claim 12, wherein the phosphor is allowed to settle for at least 30 minutes. ### Claim 16 (depends on 12) The method of claim 12, further comprising partially curing the first resin after forming the first resin on the light-emitting diode chip. ### Claim 17 (depends on 16) The method of claim 16, further comprising fully curing the first resin and the second resin after correcting the color coordinates. ### Claim 18 A method of fabricating a light-emitting device, the method comprising: forming a first resin comprising a phosphor on a light-emitting diode chip mounted on a package body; measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor; and correcting the color coordinates by mixing a phosphor-containing or phosphor-free second resin with the first resin, wherein the first resin is not fully cured before measuring and correcting the color coordinates.