# US 2017/0287976 A1 · Image pickup element, image pickup apparatus, and method of manufacturing image pickup element

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- Number: US 2017/0287976 A1
- Document ID: US20170287976A1
- Status: Published application
- Kind: A1
- Application number: 15/512,246
- Filed: 2015-08-06
- Published: 2017-10-05
- Earliest claimed: 2014-09-24
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Takeshi YANAGITA; Yasushi TATESHITA; Kazunobu OTA
- Web page: https://patentgrep.com/patent/US20170287976A1

## CPC

- H10F 39/016: {of thin-film-based image sensors}
- H04N 25/76: Addressed sensors, e.g. MOS or CMOS sensors
- H10F 39/014: {of CMOS image sensors}
- H10F 39/024: {of coatings or optical elements}
- H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F 39/184: {Infrared image sensors}
- H10F 39/199: {Back-illuminated image sensors}
- H10F 39/8023: {Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery}
- H10F 39/8057: {Optical shielding}
- H10F 39/8063: {Microlenses}
- H10F 39/15: Charge-coupled device [CCD] image sensors
- H10F 39/8053: {Colour filters}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

Image quality is improved. In an image pickup element, an interval between adjacent light receiving elements on a light receiving surface is changed depending on a position on the light receiving surface. Further, the image pickup element is manufactured by a method of manufacturing the image pickup element including layering photodiodes by repeatedly performing a silicon epitaxial process and an ion injection process. Further, the image pickup element is manufactured by the method of manufacturing the image pickup element including changing an interval between the photodiodes adjacent on the light receiving surface of the image pickup element in each layer depending on a position on the light receiving surface in addition to the layering thereof.

## Claims

### Claim 1

An image pickup element, wherein
an interval between adjacent light receiving elements on a light receiving surface is changed depending on a position on the light receiving surface.

### Claim 2 (depends on 1)

The image pickup element according to claim 1,
the image pickup element being a back-surface irradiation type COMS (Complementary Metal Oxide Semiconductor) sensor, wherein
the light receiving elements are formed in such a manner that the adjacent light receiving elements are arranged at an equal interval on a pixel transistor side, and the light receiving elements are formed in such a manner that the adjacent light receiving elements are arranged at different intervals depending on positions on the light receiving surface on a light incident side.

### Claim 3 (depends on 1)

The image pickup element according to claim 1, wherein
the light receiving elements are formed along light paths of light incident from opening portions of the light receiving elements.

### Claim 4 (depends on 1)

The image pickup element according to claim 1, wherein
the light receiving elements are divided into pieces and silicon-epitaxially formed.

### Claim 5 (depends on 1)

The image pickup element according to claim 1, wherein
the intervals between the adjacent light receiving elements are linearly or nonlinearly changed from a center of the light receiving surface toward field angle ends.

### Claim 6 (depends on 1)

The image pickup element according to claim 1, wherein
an interval between inter-pixel light shielding films disposed between the adjacent light receiving elements is changed depending on a position on the light receiving surface.

### Claim 7 (depends on 1)

The image pickup element according to claim 1, wherein
an interval between lenses disposed on the light receiving elements is changed depending on a position on the light receiving surface.

### Claim 8

An image pickup apparatus, comprising:
an image pickup element in which an interval between adjacent light receiving elements on a light receiving surface is changed depending on a position on the light receiving surface.

### Claim 9

A method of manufacturing an image pickup element, comprising:
layering photodiodes by repeatedly performing a silicon epitaxial process and an ion injection process; and
changing an interval between the photodiodes adjacent on a light receiving surface of an image pickup element in each layer depending on a position on the light receiving surface.